STM32F103VBT6 STMicroelectronics, STM32F103VBT6 Datasheet - Page 91

• Manufacturer Part Number: STM32F103VBT6
• Description: MCU ARM 128KB FLASH MEM 100-LQFP
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F103VBT6

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
• Peripherals: DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
• Number Of I /o: 80
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 20K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-LQFP
• Processor Series: STM32F103x
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 20 KB
• Interface Type: CAN/I2C/SPI/USART/USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 80
• Number Of Timers: 4
• Operating Supply Voltage: 2 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: ST-LINK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 2 (16-ch x 12-bit)
• Controller Family/series: (ARM Cortex) STM32
• No. Of I/o's: 80
• Ram Memory Size: 20KB
• Cpu Speed: 72MHz
• No. Of Timers: 4
• Cpu Family: STM32
• Device Core: ARM Cortex-M3
• Device Core Size: 32b
• Frequency (max): 72MHz
• Total Internal Ram Size: 20KB
• # I/os (max): 80
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 2V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 100
• Package Type: LQFP
• For Use With: 497-10048 - BOARD EVAL ACCELEROMETER497-10030 - STARTER KIT FOR STM32497-9091 - LED BOARD FOR STM32 STP16DP05497-8853 - BOARD DEMO STM32 UNIV USB-UUSCIKSDKSTM32-PL - KIT IAR KICKSTART STM32 CORTEXM3497-8512 - KIT STARTER FOR STM32F10XE MCU497-8511 - KIT STARTER FOR STM32 512K FLASH497-8505 - KIT STARTER FOR STM32F10XE MCU497-8304 - KIT STM32 MOTOR DRIVER BLDC497-6438 - BOARD EVALUTION FOR STM32 512K497-6289 - KIT PERFORMANCE STICK FOR STM32MCBSTM32UME - BOARD EVAL MCBSTM32 + ULINK-MEMCBSTM32U - BOARD EVAL MCBSTM32 + ULINK2MCBSTM32 - BOARD EVAL FOR STM STM32X SER497-6053 - KIT STARTER FOR STM32497-6052 - KIT STARTER FOR STM32497-6050 - KIT STARTER FOR STM32497-6049 - KIT EVALUATION LOW COST STM32497-6048 - BOARD EVALUATION FOR STM32497-6047 - KIT DEVELOPMENT FOR STM32497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-6070

STM32F103x8, STM32F103xB
Table 59.
18-Oct-2007
Date
Document revision history (continued)
Revision
3
STM32F103CBT6, STM32F103T6 and STM32F103T8 root part
numbers added (see
features and peripheral
VFQFPN36 package added (see
All packages are ECOPACK® compliant. Package mechanical data
inch values are calculated from mm and rounded to 4 decimal digits
(see
Table 5: Medium-density STM32F103xx pin definitions
clarified.
Table 26: Low-power mode wakeup timings
T
Note 2
V
Note 3
Output voltage
Note 1
Equation 1
Section 5.3.17: 12-bit ADC
V
and t
Figure 36: ADC accuracy characteristics
below
Electrostatic discharge (ESD) on page 57
Number of TIM4 channels modified in
performance line block
Maximum current consumption
updated. V
Table 48: ADC accuracy
conditions at power-up /
EMS
Values corrected, note 2 modified and note 3 removed in
Low-power mode wakeup
Table 16: Typical and maximum current consumptions in Stop and
Standby
modified,
Table 21: Typical current consumption in Standby mode
peripheral current consumption on page 48
ACC
V
Upper option byte address modified in
Typical f
internal RC value corrected from 32 to 40 kHz in entire document.
T
Table 29: Flash memory endurance and data
T
Handling of unused pins specified in
characteristics on page
Figure 38: Power supply and reference decoupling (V
connected to V
t
Appendix A: Important notes on page 81
Added
JITTER
A
AIN
S_temp
S_vrefint
ESD(CDM)
prog
min corrected in
Doc ID 13587 Rev 12
, t
HSI
Section 6: Package
latr
characteristics.
added to
S
Figure 37: Typical connection diagram using the
Figure
added below
added and V
modified under
and f
added in
max, t
LSI
values updated in
added to
modes: Typical values added for V
added to
Note 2
hys
value added to
and
value added in
VCO
modified in
CONV
15,
DDA
Table 28: Flash memory
characteristics.
Table 46: R
removed from
added.
Table 45: ADC
Table 49: TS
Figure
Table 12: Embedded internal reference
)
, V
Table 12: Embedded internal reference
OH
modified.
Table 22: HSE 4-16 MHz oscillator
Table 2: STM32F103xx medium-density device
REF+
Table 36: I/O AC
diagram.
parameter description modified in
counts)
58. All I/Os are CMOS and TTL compliant.
power-down. V
updated. t
characteristics).
16,
Table 34: I/O static
timings.
Table 32: ESD absolute maximum
Table 24: HSI oscillator
Table 25: LSI oscillator characteristics
AIN
min and t
characteristics.
Figure 18
Changes
max for f
characteristics. N
Table 27: PLL
Table
characteristics.
Section 6: Package
VDD
lat
General input/output
13,
Figure 1: STM32F103xx
Figure 10: Memory
and
max modified, notes modified
modified in
FESD
ADC
characteristics.
characteristics.
updated.
Table 14
added.
modified.
DD
Figure
updated.
added.
= 14 MHz
characteristics.
value added in
retention.
/V
characteristics.
BAT
END
Note 1
and
characteristics.
20.
Table 10: Operating
= 2.4 V,
Revision history
modified in
REF+
characteristics).
added to
Table 15
updated and
ADC.
added.
characteristics.
Table 26:
Table 35:
modified
voltage.
map.
not
voltage.
Note 2
Table 30:
ratings.
On-chip
and
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