MC9S08AC16MBE Freescale Semiconductor, MC9S08AC16MBE Datasheet - Page 17

• Manufacturer Part Number: MC9S08AC16MBE
• Description: IC MCU 8BIT 16K FLASH 42SDIP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08AC16MBE

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 32
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 42-DIP (0.600", 15.24mm)
• Processor Series: S08AC
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 1 KB
• Interface Type: I2C, SCI, SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 32
• Operating Supply Voltage: 2.7 V to 5.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08AC60E, DEMOACEX, DEMOACKIT, DCF51AC256, DC9S08AC128, DC9S08AC16, DC9S08AC60, DEMO51AC256KIT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Section Number
14.6 Initialization Information ..............................................................................................................263
14.7 Application Information ................................................................................................................265
15.1 Introduction ...................................................................................................................................271
15.2 Background Debug Controller (BDC) ..........................................................................................272
15.3 On-Chip Debug System (DBG) ....................................................................................................281
15.4 Register Definition ........................................................................................................................285
A.1 Introduction ....................................................................................................................................293
A.2 Parameter Classification.................................................................................................................293
A.3 Absolute Maximum Ratings...........................................................................................................293
A.4 Thermal Characteristics..................................................................................................................294
A.5 ESD Protection and Latch-Up Immunity .......................................................................................296
A.6 DC Characteristics..........................................................................................................................297
A.7 Supply Current Characteristics.......................................................................................................301
A.8 ADC Characteristics.......................................................................................................................304
A.9 Internal Clock Generation Module Characteristics ........................................................................307
A.10 AC Characteristics..........................................................................................................................311
Freescale Semiconductor
14.5.7 MCU Stop3 Mode Operation ..........................................................................................262
14.5.8 MCU Stop1 and Stop2 Mode Operation .........................................................................263
14.6.1 ADC Module Initialization Example .............................................................................263
14.7.1 External Pins and Routing ..............................................................................................265
14.7.2 Sources of Error ..............................................................................................................267
15.1.1 Features ...........................................................................................................................272
15.2.1 BKGD Pin Description ...................................................................................................273
15.2.2 Communication Details ..................................................................................................274
15.2.3 BDC Commands .............................................................................................................278
15.2.4 BDC Hardware Breakpoint .............................................................................................280
15.3.1 Comparators A and B .....................................................................................................281
15.3.2 Bus Capture Information and FIFO Operation ...............................................................281
15.3.3 Change-of-Flow Information ..........................................................................................282
15.3.4 Tag vs. Force Breakpoints and Triggers .........................................................................282
15.3.5 Trigger Modes .................................................................................................................283
15.3.6 Hardware Breakpoints ....................................................................................................285
15.4.1 BDC Registers and Control Bits .....................................................................................285
15.4.2 System Background Debug Force Reset Register (SBDFR) ..........................................287
15.4.3 DBG Registers and Control Bits .....................................................................................288
A.9.1 ICG Frequency Specifications .........................................................................................308
Electrical Characteristics and Timing Specifications
MC9S08AC16 Series Data Sheet, Rev. 8
Development Support
Appendix A
Chapter 15
Title
Page
17