MC908AP64CFAE Freescale Semiconductor, MC908AP64CFAE Datasheet - Page 320

IC MCU 64K 8MHZ SPI 48-LQFP

MC908AP64CFAE

Manufacturer Part Number
MC908AP64CFAE
Description
IC MCU 64K 8MHZ SPI 48-LQFP
Manufacturer
Freescale Semiconductor
Series
HC08r
Datasheets

Specifications of MC908AP64CFAE

Core Processor
HC08
Core Size
8-Bit
Speed
8MHz
Connectivity
I²C, IRSCI, SCI, SPI
Peripherals
LED, LVD, POR, PWM
Number Of I /o
32
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
48-LQFP
Cpu Family
HC08
Device Core Size
8b
Frequency (max)
8MHz
Interface Type
SCI/SPI
Total Internal Ram Size
2KB
# I/os (max)
32
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
3.3/5V
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
2.7V
On-chip Adc
8-chx10-bit
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
48
Package Type
LQFP
Controller Family/series
HC08
No. Of I/o's
32
Ram Memory Size
2KB
Cpu Speed
8MHz
No. Of Timers
2
Embedded Interface Type
I2C, SCI, SPI
Rohs Compliant
Yes
Processor Series
HC08AP
Core
HC08
Data Bus Width
8 bit
Data Ram Size
2 KB
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
32
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Development Tools By Supplier
FSICEBASE, DEMO908AP64E, M68CBL05CE
Minimum Operating Temperature
- 40 C
Package
48LQFP
Family Name
HC08
Maximum Speed
8 MHz
Operating Supply Voltage
3.3|5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC908AP64CFAE
Manufacturer:
Freescale
Quantity:
3 359
Part Number:
MC908AP64CFAE
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC908AP64CFAER
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Mechanical Specifications
23.4 42-Pin Shrink Dual In-Line Package (SDIP)
318
SEATING
PLANE
–T–
42
1
D
F
0.25 (0.010)
42 PL
–A–
M
T
G
A
Figure 23-3. 42-Pin SDIP (Case #858)
S
MC68HC908AP Family Data Sheet, Rev. 4
22
21
N
C
K
–B–
J
42 PL
0.25 (0.010)
M
H
T
L
B
M
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
Y14.5M, 1982.
FORMED PARALLEL.
FLASH. MAXIMUM MOLD FLASH 0.25 (0.010).
DIM
A
B
C
D
G
H
K
M
N
F
J
L
1.435
0.540
0.155
0.014
0.032
0.008
0.020
0.115
MIN
0.070 BSC
0.300 BSC
0.600 BSC
INCHES
Freescale Semiconductor
MAX
1.465
0.560
0.200
0.022
0.046
0.015
0.135
0.040
15°
36.45
13.72
MILLIMETERS
MIN
3.94
0.36
0.81
0.20
2.92
0.51
1.778 BSC
15.24 BSC
7.62 BSC
37.21
14.22
MAX
5.08
0.56
1.17
0.38
3.43
15°
1.02

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