MC9S12E128CPVE Freescale Semiconductor, MC9S12E128CPVE Datasheet - Page 478

• Manufacturer Part Number: MC9S12E128CPVE
• Description: IC MCU 128K FLASH 25MHZ 112-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12E128CPVE

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: EBI/EMI, I²C, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 91
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 2.75 V
• Data Converters: A/D 16x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 112-LQFP
• Processor Series: S12E
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 8 KB
• Interface Type: SCI/SPI
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 92
• Number Of Timers: 12
• Operating Supply Voltage: 3.135 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 16-ch x 10-bit
• On-chip Dac: 2-ch x 8-bit
• Controller Family/series: HCS12/S12X
• No. Of I/o's: 90
• Ram Memory Size: 8KB
• Cpu Speed: 25MHz
• No. Of Timers: 4
• Embedded Interface Type: I2C, SCI, SPI
• Rohs Compliant: Yes
• For Use With: M68EVB912E128 - BOARD EVAL FOR MC9S12E128/64
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Chapter 16 Debug Module (DBGV1)
16.3
A summary of the registers associated with the DBG sub-block is shown in
descriptions of the registers and bits are given in the subsections that follow.
16.3.1
16.3.2
This section consists of the DBG register descriptions in address order. Most of the register bits can be
written to in either BKP or DBG mode, although they may not have any effect in one of the modes.
However, the only bits in the DBG module that can be written while the debugger is armed (ARM = 1) are
DBGEN and ARM
478
DBGSC
DBGC1
Name
Memory Map and Register Definition
Address
1
Offset
Module Memory Map
Register Descriptions
A
B
E
F
4
5
6
8
9
W
W
R
R
Debug Control Register (DBGC1)
Debug Status and Control Register (DBGSC)
Debug Trace Buffer Register High (DBGTBH)
Debug Trace Buffer Register Low (DBGTBL)
Debug Control Register 2 (DBGC2) / (BKPCT0)
Debug Control Register 3 (DBGC3) / (BKPCT1)
Debug Comparator A Extended Register (DBGCAX) / (/BKP0X)
Debug Comparator A Register High (DBGCAH) / (BKP0H)
Debug Comparator A Register Low (DBGCAL) / (BKP0L)
Debug Comparator B Extended Register (DBGCBX) / (BKP1X)
Debug Comparator B Register High (DBGCBH) / (BKP1H)
Debug Comparator B Register Low (DBGCBL) / (BKP1L)
Debug Count Register (DBGCNT)
Debug Comparator C Extended Register (DBGCCX)
Debug Comparator C Register High (DBGCCH)
Debug Comparator C Register Low (DBGCCL)
DBGEN
Bit 7
AF
= Unimplemented or Reserved
Figure 16-3. DBG Register Summary
ARM
BF
Table 16-2. DBGV1 Memory Map
6
MC9S12E128 Data Sheet, Rev. 1.07
TRGSEL
CF
5
Use
BEGIN
4
0
DBGBRK
3
Figure
2
0
TRG
16-3. Detailed
Freescale Semiconductor
Access
1
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
CAPMOD
R
R
R
Bit 0