MC9S12E128CPVE Freescale Semiconductor, MC9S12E128CPVE Datasheet - Page 590

IC MCU 128K FLASH 25MHZ 112-LQFP

MC9S12E128CPVE

Manufacturer Part Number
MC9S12E128CPVE
Description
IC MCU 128K FLASH 25MHZ 112-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheets

Specifications of MC9S12E128CPVE

Core Processor
HCS12
Core Size
16-Bit
Speed
25MHz
Connectivity
EBI/EMI, I²C, SCI, SPI
Peripherals
POR, PWM, WDT
Number Of I /o
91
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.35 V ~ 2.75 V
Data Converters
A/D 16x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
112-LQFP
Processor Series
S12E
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
8 KB
Interface Type
SCI/SPI
Maximum Clock Frequency
25 MHz
Number Of Programmable I/os
92
Number Of Timers
12
Operating Supply Voltage
3.135 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Minimum Operating Temperature
- 40 C
On-chip Adc
16-ch x 10-bit
On-chip Dac
2-ch x 8-bit
Controller Family/series
HCS12/S12X
No. Of I/o's
90
Ram Memory Size
8KB
Cpu Speed
25MHz
No. Of Timers
4
Embedded Interface Type
I2C, SCI, SPI
Rohs Compliant
Yes
For Use With
M68EVB912E128 - BOARD EVAL FOR MC9S12E128/64
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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1
2
Appendix A Electrical Characteristics
A.6.2
The
The following constraints exist to obtain full-scale, full range results:
VSSA VRL VIN VRH VDDA This constraint exists since the sample buffer amplifier can not
drive beyond the power supply levels that it ties to. If the input level goes outside of this range it will
effectively be clipped.
A.6.3
Three factors — source resistance, source capacitance and current injection — have an influence on the
accuracy of the ATD.
A.6.3.1
Due to the input pin leakage current as specified in
resistance there will be a voltage drop from the signal source to the ATD input. The maximum source
resistance R
If device or operating conditions are less than worst case or leakage-induced error is acceptable, larger
values of source resistance are allowed.
590
Conditions are shown in
Num C
The minimum time assumes a final sample period of 2 ATD clocks cycles while the maximum time assumes a final sample
period of 16 ATD clocks.
Reduced accuracy see
1
2
3
4
5
6
7
Table A-20
D Reference Potential
C Differential Reference Voltage
D ATD Clock Frequency
D ATD 10-Bit Conversion Period
D ATD 8-Bit Conversion Period
D Recovery Time (V
P Reference Supply current
ATD Operating Characteristics — 3.3V Range
S
Factors Influencing Accuracy
Source Resistance
specifies results in an error of less than 1/2 LSB (2.5mV) at the maximum leakage current.
shows conditions under which the ATD operates.
Conv, Time at 4.0MHz
Conv, Time at 2.0MHz ATD Clock f
Conv, Time at 2.0MHz ATD Clock f
Table A-4
Table A-22
DDA
=3.3 Volts)
Rating
unless otherwise noted; Supply Voltage 3.3V-10% <= V
Table A-20. 3.3V ATD Operating Characteristics
and
Table
2
MC9S12E128 Data Sheet, Rev. 1.07
ATD Clock f
A-23.
Clock Cycles
Clock Cycles
ATDCLK
ATDCLK
ATDCLK
High
Low
Table A-6
1
1
N
V
T
T
Symbol
N
f
T
ATDCLK
RH
CONV10
CONV10
CONV10
CONV8
CONV8
t
V
I
V
REC
REF
RH
RL
-V
and
RL
Table A-7
V
V
DDA
Min
3.0
0.5
3.5
14
12
SSA
7
6
/2
DDA
in conjunction with the source
<= 3.3V+10%
Typ
3.3
Freescale Semiconductor
V
0.250
V
Max
DDA
3.6
2.0
28
14
26
13
20
DDA
7
/2
Cycles
Cycles
MHz
Unit
mA
V
V
V
s
s
s
s

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