MC9S12E128CPVE Freescale Semiconductor, MC9S12E128CPVE Datasheet - Page 81

• Manufacturer Part Number: MC9S12E128CPVE
• Description: IC MCU 128K FLASH 25MHZ 112-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12E128CPVE

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: EBI/EMI, I²C, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 91
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 2.75 V
• Data Converters: A/D 16x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 112-LQFP
• Processor Series: S12E
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 8 KB
• Interface Type: SCI/SPI
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 92
• Number Of Timers: 12
• Operating Supply Voltage: 3.135 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 16-ch x 10-bit
• On-chip Dac: 2-ch x 8-bit
• Controller Family/series: HCS12/S12X
• No. Of I/o's: 90
• Ram Memory Size: 8KB
• Cpu Speed: 25MHz
• No. Of Timers: 4
• Embedded Interface Type: I2C, SCI, SPI
• Rohs Compliant: Yes
• For Use With: M68EVB912E128 - BOARD EVAL FOR MC9S12E128/64
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

1.10
The Printed Circuit Board (PCB) must be carefully laid out to ensure proper operation of the voltage
regulator as well as the MCU itself. The following rules must be observed:
Freescale Semiconductor
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Every supply pair must be decoupled by a ceramic capacitor connected as near as possible to the
corresponding pins (C1–C6).
Central point of the ground star should be the VSSR pin.
Use low ohmic low inductance connections between VSS1, VSS2 and VSSR.
VSSPLL must be directly connected to VSSR.
Keep traces of VSSPLL, EXTAL and XTAL as short as possible and occupied board area for C7,
C8, C11 and Q1 as small as possible.
Do not place other signals or supplies underneath area occupied by C7, C8, C10 and Q1 and the
connection area to the MCU.
Central power input should be fed in at the VDDA/VSSA pins.
Recommended Printed Circuit Board Layout
Component
C10
C11
Q1
C1
C2
C3
C4
C5
C6
C7
C8
C9
R1
Table 1-11. Recommended Decoupling Capacitor Choice
VDD2 filter cap (80 QFP only)
VDDPLL filter cap
PLL loop filter cap
PLL loop filter cap
PLL loop filter res
VDDR filter cap
VDDX filter cap
VDD1 filter cap
VDDA filter cap
OSC load cap
OSC load cap
DC cutoff cap
MC9S12E128 Data Sheet, Rev. 1.07
Purpose
Quartz
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
X7R/tantalum
X7R/tantalum
Ceramic X7R
Ceramic X7R
Ceramic X7R
Ceramic X7R
See PLL specification chapter
Type
100–220nF
100–220nF
>=100nF
>=100nF
100nF
100nF
Value
81