MC9S12XDT256CAA Freescale Semiconductor, MC9S12XDT256CAA Datasheet - Page 1239

IC MCU 256K FLASH 80-QFP

MC9S12XDT256CAA

Manufacturer Part Number
MC9S12XDT256CAA
Description
IC MCU 256K FLASH 80-QFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet

Specifications of MC9S12XDT256CAA

Core Processor
HCS12X
Core Size
16-Bit
Speed
80MHz
Connectivity
CAN, EBI/EMI, I²C, IrDA, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
59
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
2.35 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
80-QFP
Processor Series
S12XD
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
16 KB
Interface Type
CAN/I2C/SCI/SPI
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
59
Number Of Timers
12
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
EVB9S12XDP512E
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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A.1.5
Absolute maximum ratings are stress ratings only. A functional operation under or outside those maxima
is not guaranteed. Stress beyond those limits may affect the reliability or cause permanent damage of the
device.
This device contains circuitry protecting against damage due to high static voltage or electrical fields;
however, it is advised that normal precautions be taken to avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage level (e.g., either V
1
2
3
4
5
A.1.6
All ESD testing is in conformity with CDF-AEC-Q100 stress test qualification for automotive grade
integrated circuits. During the device qualification ESD stresses were performed for the Human Body
Model (HBM) and the Charge Device Model.
A device will be defined as a failure if after exposure to ESD pulses the device no longer meets the device
specification. Complete DC parametric and functional testing is performed per the applicable device
Freescale Semiconductor
Num
Beyond absolute maximum ratings device might be damaged.
The device contains an internal voltage regulator to generate the logic and PLL supply out of the I/O supply. The absolute
maximum ratings apply when the device is powered from an external source.
All digital I/O pins are internally clamped to V
Those pins are internally clamped to V
This pin is clamped low to V
10
11
12
13
1
2
3
4
5
6
7
8
9
I/O, regulator and analog supply voltage
Digital logic supply voltage
PLL supply voltage
Voltage difference V
Voltage difference V
Digital I/O input voltage
Analog reference
XFC, EXTAL, XTAL inputs
TEST input
Instantaneous maximum current
Instantaneous maximum current
Instantaneous maximum current
Storage temperature range
Single pin limit for all digital I/O pins
Single pin limit for XFC, EXTAL, XTAL
Single pin limit for TEST
Absolute Maximum Ratings
ESD Protection and Latch-up Immunity
2
DDX
SSX
SSPLL
to V
to V
, but not clamped high. This pin must be tied low in applications.
2
5
SSR
DDR
Rating
Table A-1. Absolute Maximum Ratings
SSPLL
and V
and V
MC9S12XDP512 Data Sheet, Rev. 2.21
and V
SSX
SSA
3
DDA
4
and V
DDPLL
DDX
.
, V
SSR
and V
DDR
SS35
V
or V
Symbol
V
V
V
RH,
DDPLL
T stg
V
V
VDDX
VSSX
DD35
V
TEST
I
I
I
DL
DT
DD
ILV
D
IN
SSA
V
or V
1
RL
and V
DD35
Appendix A Electrical Characteristics
DDA
–0.25
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
Min
–25
–25
–65
).
.
Max
10.0
+25
+25
155
6.0
3.0
3.0
0.3
0.3
6.0
6.0
3.0
0
Unit
mA
mA
mA
V
V
V
V
V
V
V
V
V
1241
C

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