MC9S12XDT256CAA Freescale Semiconductor, MC9S12XDT256CAA Datasheet - Page 1240

• Manufacturer Part Number: MC9S12XDT256CAA
• Description: IC MCU 256K FLASH 80-QFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XDT256CAA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 59
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-QFP
• Processor Series: S12XD
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 16 KB
• Interface Type: CAN/I2C/SCI/SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 59
• Number Of Timers: 12
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: EVB9S12XDP512E
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Appendix A Electrical Characteristics
specification at room temperature followed by hot temperature, unless specified otherwise in the device
specification.
1242
Human Body
Latch-up
Num
1
2
3
4
Model
C
C
C
C
C
Series resistance
Storage capacitance
Number of pulse per pin
Minimum input voltage limit
Maximum input voltage limit
Human Body Model (HBM)
Charge Device Model (CDM)
Latch-up current at T
Latch-up current at T
Positive
Negative
Positive
Negative
Positive
Negative
Table A-3. ESD and Latch-Up Protection Characteristics
Table A-2. ESD and Latch-up Test Conditions
A
A
= 125 C
= 27 C
MC9S12XDP512 Data Sheet, Rev. 2.21
Rating
Description
Symbol
V
V
I
I
CDM
HBM
LAT
LAT
Symbol
+100
+200
2000
–100
–200
Min
500
R1
—
—
C
Freescale Semiconductor
Value
1500
–2.5
Max
100
7.5
—
—
—
—
—
—
3
3
Ohm
Unit
Unit
mA
mA
pF
V
V
V
V