MC9S12XDT256CAA Freescale Semiconductor, MC9S12XDT256CAA Datasheet - Page 1260

• Manufacturer Part Number: MC9S12XDT256CAA
• Description: IC MCU 256K FLASH 80-QFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XDT256CAA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 59
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-QFP
• Processor Series: S12XD
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 16 KB
• Interface Type: CAN/I2C/SCI/SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 59
• Number Of Timers: 12
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: EVB9S12XDP512E
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Appendix A Electrical Characteristics
A.3.2
The reliability of the NVM blocks is guaranteed by stress test during qualification, constant process
monitors and burn-in to screen early life failures. The program/erase cycle count on the sector is
incremented every time a sector or mass erase event is executed
1
2
3
1262
Conditions are shown in
Num C
T
application.
Typical data retention values are based on intrinsic capability of the technology measured at high temperature and de-rated to
25 C using the Arrhenius equation. For additional information on how Freescale defines Typical Data Retention, please refer
to Engineering Bulletin EB618.
Spec table quotes typical endurance evaluated at 25 C for this product family, typical endurance at various temperature can
be estimated using the graph below. For additional information on how Freescale defines Typical Endurance, please refer to
Engineering Bulletin EB619.
1
2
3
4
5
6
7
8
Javg
C Data retention after 10,000 program/erase cycles at an
C Data retention with <100 program/erase cycles at an
C Number of program/erase cycles
C Number of program/erase cycles
C Data retention after up to 100,000 program/erase cycles
C Data retention with <100 program/erase cycles at an
C Number of program/erase cycles
C Number of program/erase cycles
will not exeed 85 C considering a typical temperature profile over the lifetime of a consumer, industrial or automotive
average junction temperature of T
average junction temperature T
(–40 C
(0 C
at an average junction temperature of T
average junction temperature T
(–40 C
(0 C < T
NVM Reliability
T
J
J
T
T
J
J
140 C)
140 C)
Table A-4
0 C)
0 C)
unless otherwise noted
Rating
Table A-18. NVM Reliability Characteristics
Javg
Javg
MC9S12XDP512 Data Sheet, Rev. 2.21
EEPROM Reliability Characteristics
Javg
Flash Reliability Characteristics
85 C
85 C
Javg
85 C
85 C
Symbol
t
EEPRET
t
FLRET
n
n
EEP
FL
100,000
10,000
10,000
10,000
Min
15
20
15
20
1
100,000
300,000
100
100
100
100
Typ
—
—
2
2
2
2
Freescale Semiconductor
3
3
Max
—
—
—
—
—
—
—
—
Cycles
Cycles
Years
Years
Unit