C8051F021-GQ Silicon Laboratories Inc, C8051F021-GQ Datasheet - Page 146

IC 8051 MCU 64K FLASH 64TQFP

C8051F021-GQ

Manufacturer Part Number
C8051F021-GQ
Description
IC 8051 MCU 64K FLASH 64TQFP
Manufacturer
Silicon Laboratories Inc
Series
C8051F02xr
Datasheets

Specifications of C8051F021-GQ

Program Memory Type
FLASH
Program Memory Size
64KB (64K x 8)
Package / Case
64-TQFP, 64-VQFP
Core Processor
8051
Core Size
8-Bit
Speed
25MHz
Connectivity
EBI/EMI, SMBus (2-Wire/I²C), SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Number Of I /o
32
Ram Size
4.25K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x8b, 8x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
C8051F0x
Core
8051
Data Bus Width
8 bit
Data Ram Size
4.25 KB
Interface Type
I2C/SMBus/SPI/UART
Maximum Clock Frequency
25 MHz
Number Of Programmable I/os
32
Number Of Timers
4
Operating Supply Voltage
2.7 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
PK51, CA51, A51, ULINK2
Development Tools By Supplier
C8051F020DK
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 8-bit or 8-ch x 12-bit
On-chip Dac
2-ch x 12-bit
No. Of I/o's
32
Ram Memory Size
4352Byte
Cpu Speed
25MHz
No. Of Timers
5
No. Of Pwm Channels
5
Rohs Compliant
Yes
Data Rom Size
64 KB
A/d Bit Size
12 bit
A/d Channels Available
8
Height
1.05 mm
Length
10 mm
Supply Voltage (max)
3.6 V
Supply Voltage (min)
2.7 V
Width
10 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
336-1200 - DEV KIT FOR F020/F021/F022/F023
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1201

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C8051F020/1/2/3
16.2. Configuring the External Memory Interface
Configuring the External Memory Interface consists of four steps:
Each of these four steps is explained in detail in the following sections. The Port selection, Multiplexed mode selec-
tion, and Mode bits are located in the EMI0CF register shown in Figure 16.2.
16.3. Port Selection and Configuration
The External Memory Interface can appear on Ports 3, 2, 1, and 0 (C8051F020/1/2/3 devices) or on Ports 7, 6, 5, and
4 (C8051F020/2 devices only), depending on the state of the PRTSEL bit (EMI0CF.5). If the lower Ports are selected,
the EMIFLE bit (XBR2.1) must be set to a ‘1’ so that the Crossbar will skip over P0.7 (/WR), P0.6 (/RD), and if mul-
tiplexed mode is selected P0.5 (ALE). For more information about the configuring the Crossbar, see
“17. PORT INPUT/OUTPUT” on page
The External Memory Interface claims the associated Port pins for memory operations ONLY during the execution of
an off-chip MOVX instruction. Once the MOVX instruction has completed, control of the Port pins reverts to the Port
latches or to the Crossbar (on Ports 3, 2, 1, and 0). See
more information about the Crossbar and Port operation and configuration. The Port latches should be explicitly
configured to ‘park’ the External Memory Interface pins in a dormant state, most commonly by setting them
to a logic 1.
During the execution of the MOVX instruction, the External Memory Interface will explicitly disable the drivers on
all Port pins that are acting as Inputs (Data[7:0] during a READ operation, for example). The Output mode of the Port
pins (whether the pin is configured as Open-Drain or Push-Pull) is unaffected by the External Memory Interface oper-
ation, and remains controlled by the PnMDOUT registers. See
for more information about Port output mode configuration.
146
1.
2.
3.
off-chip only).
4.
5.
Select EMIF on Low Ports (P3, P2, P1, and P0) or High Ports (P7, P6, P5, and P4).
Select Multiplexed mode or Non-multiplexed mode.
Select the memory mode (on-chip only, split mode without bank select, split mode with bank select, or
Set up timing to interface with off-chip memory or peripherals.
Select the desired output mode for the associated Ports (registers PnMDOUT, P74OUT).
161.
Rev. 1.4
Section “17. PORT INPUT/OUTPUT” on page 161
Section “17. PORT INPUT/OUTPUT” on page 161
Section
for

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