C8051F021-GQ Silicon Laboratories Inc, C8051F021-GQ Datasheet - Page 150

IC 8051 MCU 64K FLASH 64TQFP

C8051F021-GQ

Manufacturer Part Number
C8051F021-GQ
Description
IC 8051 MCU 64K FLASH 64TQFP
Manufacturer
Silicon Laboratories Inc
Series
C8051F02xr
Datasheets

Specifications of C8051F021-GQ

Program Memory Type
FLASH
Program Memory Size
64KB (64K x 8)
Package / Case
64-TQFP, 64-VQFP
Core Processor
8051
Core Size
8-Bit
Speed
25MHz
Connectivity
EBI/EMI, SMBus (2-Wire/I²C), SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Number Of I /o
32
Ram Size
4.25K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x8b, 8x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
C8051F0x
Core
8051
Data Bus Width
8 bit
Data Ram Size
4.25 KB
Interface Type
I2C/SMBus/SPI/UART
Maximum Clock Frequency
25 MHz
Number Of Programmable I/os
32
Number Of Timers
4
Operating Supply Voltage
2.7 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
PK51, CA51, A51, ULINK2
Development Tools By Supplier
C8051F020DK
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 8-bit or 8-ch x 12-bit
On-chip Dac
2-ch x 12-bit
No. Of I/o's
32
Ram Memory Size
4352Byte
Cpu Speed
25MHz
No. Of Timers
5
No. Of Pwm Channels
5
Rohs Compliant
Yes
Data Rom Size
64 KB
A/d Bit Size
12 bit
A/d Channels Available
8
Height
1.05 mm
Length
10 mm
Supply Voltage (max)
3.6 V
Supply Voltage (min)
2.7 V
Width
10 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
336-1200 - DEV KIT FOR F020/F021/F022/F023
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1201

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C8051F020/1/2/3
16.5. Memory Mode Selection
The external data memory space can be configured in one of four modes, shown in Figure 16.5, based on the EMIF
Mode bits in the EMI0CF register (Figure 16.2). These modes are summarized below. More information about the
different modes can be found in
16.5.1. Internal XRAM Only
When EMI0CF.[3:2] are set to ‘00’, all MOVX instructions will target the internal XRAM space on the device. Mem-
ory accesses to addresses beyond the populated space will wrap on 4k boundaries. As an example, the addresses
0x1000 and 0x2000 both evaluate to address 0x0000 in on-chip XRAM space.
16.5.2. Split Mode without Bank Select
When EMI0CF.[3:2] are set to ‘01’, the XRAM memory map is split into two areas, on-chip space and off-chip space.
150
EMI0CF[3:2] = 00
On-Chip XRAM
On-Chip XRAM
On-Chip XRAM
On-Chip XRAM
On-Chip XRAM
On-Chip XRAM
8-bit MOVX operations use the contents of EMI0CN to determine the high-byte of the effective address and R0
or R1 to determine the low-byte of the effective address.
16-bit MOVX operations use the contents of the 16-bit DPTR to determine the effective address.
Effective addresses below the 4k boundary will access on-chip XRAM space.
Effective addresses beyond the 4k boundary will access off-chip space.
8-bit MOVX operations use the contents of EMI0CN to determine whether the memory access is on-chip or off-
chip. The lower 8-bits of the Address Bus A[7:0] are driven as defined by R0 or R1. However, in the “No Bank
Select” mode, an 8-bit MOVX operation will not drive the upper 8-bits A[15:8] of the Address Bus during an
off-chip access. This allows the user to manipulate the upper address bits at will by setting the Port state directly.
This behavior is in contrast with “Split Mode with Bank Select” described below.
16-bit MOVX operations use the contents of DPTR to determine whether the memory access is on-chip or off-
chip, and unlike 8-bit MOVX operations, the full 16-bits of the Address Bus A[15:0] are driven during the off-
chip transaction.
0xFFFF
0x0000
EMI0CF[3:2] = 01
(No Bank Select)
On-Chip XRAM
Section “ .” on page
Off-Chip
Memory
Figure 16.5. EMIF Operating Modes
0xFFFF
0x0000
152.
Rev. 1.4
EMI0CF[3:2] = 10
On-Chip XRAM
(Bank Select)
Off-Chip
Memory
0xFFFF
0x0000
EMI0CF[3:2] = 11
Off-Chip
Memory
0xFFFF
0x0000

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