C8051F021-GQ Silicon Laboratories Inc, C8051F021-GQ Datasheet - Page 33

• Manufacturer Part Number: C8051F021-GQ
• Description: IC 8051 MCU 64K FLASH 64TQFP
• Manufacturer: Silicon Laboratories Inc
• Series: C8051F02xr

Specifications of C8051F021-GQ

• Program Memory Type: FLASH
• Program Memory Size: 64KB (64K x 8)
• Package / Case: 64-TQFP, 64-VQFP
• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 25MHz
• Connectivity: EBI/EMI, SMBus (2-Wire/I²C), SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
• Number Of I /o: 32
• Ram Size: 4.25K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x8b, 8x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: C8051F0x
• Core: 8051
• Data Bus Width: 8 bit
• Data Ram Size: 4.25 KB
• Interface Type: I2C/SMBus/SPI/UART
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 32
• Number Of Timers: 4
• Operating Supply Voltage: 2.7 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: PK51, CA51, A51, ULINK2
• Development Tools By Supplier: C8051F020DK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 8-bit or 8-ch x 12-bit
• On-chip Dac: 2-ch x 12-bit
• No. Of I/o's: 32
• Ram Memory Size: 4352Byte
• Cpu Speed: 25MHz
• No. Of Timers: 5
• No. Of Pwm Channels: 5
• Rohs Compliant: Yes
• Data Rom Size: 64 KB
• A/d Bit Size: 12 bit
• A/d Channels Available: 8
• Height: 1.05 mm
• Length: 10 mm
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 2.7 V
• Width: 10 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 336-1200 - DEV KIT FOR F020/F021/F022/F023
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1201

4.
MONEN
VREFD
XTAL1
XTAL2
VREFA
VREF0
VREF1
DGND
AGND
Name
VREF
VDD
/RST
TMS
TCK
TDO
AV+
TDI
PINOUT AND PACKAGE DEFINITIONS
37, 64,
38, 63,
11, 14
10, 13
F020
F022
Pin Numbers
90
89
26
27
28
12
16
17
15
1
2
3
4
5
24, 41,
25, 40,
F021
F023
57
56
58
59
60
61
62
17
18
19
6
5
7
8
D Out JTAG Test Data Output with internal pull-up. Data is shifted out on
A Out Crystal Output. This pin is the excitation driver for a crystal or
D I/O Device Reset. Open-drain output of internal VDD monitor. Is driven
A I/O Bandgap Voltage Reference Output (all devices).
Type
D In
D In
D In
A In
D In
A In
A In
A In
A In
Table 4.1. Pin Definitions
Description
Digital Supply Voltage. Must be tied to +2.7 to +3.6 V.
Digital Ground. Must be tied to Ground.
Analog Supply Voltage. Must be tied to +2.7 to +3.6 V.
Analog Ground. Must be tied to Ground.
JTAG Test Mode Select with internal pull-up.
JTAG Test Clock with internal pull-up.
JTAG Test Data Input with internal pull-up. TDI is latched on the
rising edge of TCK.
TDO on the falling edge of TCK. TDO output is a tri-state driver.
low when VDD is <2.7 V and MONEN is high. An external source
can initiate a system reset by driving this pin low.
Crystal Input. This pin is the return for the internal oscillator circuit
for a crystal or ceramic resonator. For a precision internal clock,
connect a crystal or ceramic resonator from XTAL1 to XTAL2. If
overdriven by an external CMOS clock, this becomes the system
clock.
ceramic resonator.
VDD Monitor Enable. When tied high, this pin enables the internal
VDD monitor, which forces a system reset when VDD is < 2.7 V.
When tied low, the internal VDD monitor is disabled.
DAC Voltage Reference Input (F021/3 only).
ADC0 and ADC1 Voltage Reference Input.
ADC0 Voltage Reference Input.
ADC1 Voltage Reference Input.
DAC Voltage Reference Input.
Rev. 1.4
C8051F020/1/2/3
33