PIC18F4523-I/P Microchip Technology, PIC18F4523-I/P Datasheet - Page 369
PIC18F4523-I/P
Manufacturer Part Number
PIC18F4523-I/P
Description
IC PIC MCU FLASH 16KX16 40DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC18F2221-ISO.pdf
(46 pages)
2.PIC18F2423-ISP.pdf
(54 pages)
3.PIC18F2423-ISP.pdf
(8 pages)
4.PIC18F2423-ISP.pdf
(34 pages)
5.PIC18F2523-ISO.pdf
(392 pages)
Specifications of PIC18F4523-I/P
Program Memory Type
FLASH
Program Memory Size
32KB (16K x 16)
Package / Case
40-DIP (0.600", 15.24mm)
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
36
Eeprom Size
256 x 8
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 13x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
1.5 KB
Interface Type
EUSART/I2C/MSSP/SPI
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
36
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, 53275-917, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM163022
Minimum Operating Temperature
- 40 C
On-chip Adc
13-ch x 12-bit
Package
40PDIP
Device Core
PIC
Family Name
PIC18
Maximum Speed
40 MHz
Operating Supply Voltage
2.5|3.3|5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
444-1001 - DEMO BOARD FOR PICMICRO MCU
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18F4523-I/P
Manufacturer:
MICROCHIP
Quantity:
1 200
Company:
Part Number:
PIC18F4523-I/PT
Manufacturer:
LUMILEDS
Quantity:
1 001
Company:
Part Number:
PIC18F4523-I/PT
Manufacturer:
Microchip Technology
Quantity:
1 966
Company:
Part Number:
PIC18F4523-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC18F4523-I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- PIC18F2221-ISO PDF datasheet
- PIC18F2423-ISP PDF datasheet #2
- PIC18F2423-ISP PDF datasheet #3
- PIC18F2423-ISP PDF datasheet #4
- PIC18F2523-ISO PDF datasheet #5
- Current page: 369 of 392
- Download datasheet (7Mb)
28.2
The following sections give the technical details of the packages.
© 2007 Microchip Technology Inc.
28-Lead Skinny Plastic Dual In-Line (SP) – 300 mil Body [SPDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
NOTE 1
A1
Note:
A
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Package Details
N
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1
2
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
3
b
b1
D
PIC18F2423/2523/4423/4523
Dimension Limits
Preliminary
Units
A2
A1
E1
b1
eB
N
A
E
D
e
L
c
b
e
1.345
.120
.015
.290
.240
.008
.040
.014
A2
MIN
.110
E1
–
–
L
.100 BSC
INCHES
1.365
NOM
.135
.310
.285
.130
.010
.050
.018
28
–
–
–
Microchip Technology Drawing C04-070B
eB
E
1.400
MAX
.200
.150
.335
.295
.150
.015
.070
.022
.430
–
DS39755B-page 367
c
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