AT91SAM9M10-CU Atmel, AT91SAM9M10-CU Datasheet - Page 205
AT91SAM9M10-CU
Manufacturer Part Number
AT91SAM9M10-CU
Description
IC MCU 16/32BIT ARM9 324TFBGA
Manufacturer
Atmel
Series
AT91SAMr
Specifications of AT91SAM9M10-CU
Core Processor
ARM9
Core Size
16/32-Bit
Speed
400MHz
Connectivity
EBI/EMI, Ethernet, I²C, SPI, SSC, UART/USART, USB
Peripherals
AC'97, DMA, LCD, POR, PWM, WDT
Number Of I /o
160
Program Memory Size
64KB (64K x 8)
Program Memory Type
ROM
Ram Size
128K x 8
Voltage - Supply (vcc/vdd)
0.9 V ~ 1.1 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
324-TFBGA
Processor Series
AT91SAMx
Core
ARM926EJ-S
Data Bus Width
32 bit
Data Ram Size
32 KB
Interface Type
2-Wire, SPI, USART
Maximum Clock Frequency
133 MHz
Number Of Programmable I/os
5
Number Of Timers
2 x 16 bit
Operating Supply Voltage
1.65 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
JTRACE-ARM-2M, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
AT91SAM-ICE, AT91-ISP, AT91SAM9M10-G45-EK
Controller Family/series
AT91
No. Of I/o's
160
Ram Memory Size
64KB
Cpu Speed
400MHz
No. Of Timers
2
Rohs Compliant
Yes
Cpu Family
AT91
Device Core
ARM926EJ-S
Device Core Size
32b
Frequency (max)
400MHz
Total Internal Ram Size
64KB
# I/os (max)
160
Number Of Timers - General Purpose
7
Operating Supply Voltage (typ)
1.8/2.5/3.3V
Operating Supply Voltage (max)
1.1/1.95/3.6V
Operating Supply Voltage (min)
0.9/1.65/1.8/3V
On-chip Adc
8-chx10-bit
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
324
Package Type
TFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AT91SAM9M10-CU
Manufacturer:
Atmel
Quantity:
996
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21.10 Data Float Wait States
21.10.1
6355B–ATARM–21-Jun-10
READ_MODE
Some memory devices are slow to release the external bus. For such devices, it is necessary to
add wait states (data float wait states) after a read access:
The Data Float Output Time (t
TDF_CYCLES field of the SMC_MODE register for the corresponding chip select. The value of
TDF_CYCLES indicates the number of data float wait cycles (between 0 and 15) before the
external device releases the bus, and represents the time allowed for the data output to go to
high impedance after the memory is disabled.
Data float wait states do not delay internal memory accesses. Hence, a single access to an
external memory with long t
memory.
The data float wait states management depends on the READ_MODE and the TDF_MODE
fields of the SMC_MODE register for the corresponding chip select.
Setting the READ_MODE to 1 indicates to the SMC that the NRD signal is responsible for turn-
ing off the tri-state buffers of the external memory device. The Data Float Period then begins
after the rising edge of the NRD signal and lasts TDF_CYCLES MCK cycles.
When the read operation is controlled by the NCS signal (READ_MODE = 0), the TDF field gives
the number of MCK cycles during which the data bus remains busy after the rising edge of NCS.
Figure 21-20
assuming a data float period of 2 cycles (TDF_CYCLES = 2).
ation when controlled by NCS (READ_MODE = 0) and the TDF_CYCLES parameter equals 3.
• before starting a read access to a different external memory
• before starting a write access to the same device or to a different external one.
illustrates the Data Float Period in NRD-controlled mode (READ_MODE =1),
DF
will not slow down the execution of a program from internal
DF
) for each external memory device is programmed in the
Figure 21-21
AT91SAM9M10
shows the read oper-
205
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