ST72F325K4T6 STMicroelectronics, ST72F325K4T6 Datasheet - Page 180

• Manufacturer Part Number: ST72F325K4T6
• Description: MCU 8BIT 16KB FLASH/ROM 32-LQFP
• Manufacturer: STMicroelectronics
• Series: ST7r

Specifications of ST72F325K4T6

• Core Processor: ST7
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 24
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 3.8 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 32-LQFP
• Processor Series: ST72F3x
• Core: ST7
• Data Bus Width: 8 bit
• Data Ram Size: 512 B
• Interface Type: I2C, SCI, SPI
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 48
• Number Of Timers: 2
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: ST7232X-EVAL, ST7232X-SK/RAIS, ST72325-D/RAIS, ST7MDT20-DVP3, ST7MDT20J-EMU3, ST7MDT20M-EMU3, STX-RLINK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 16 Channel
• For Use With: 497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: 497-5605

ST72325xx
13.3 SOLDERING INFORMATION
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In order to meet environmental requirements,
ST offers these devices in ECOPACK®
packages. These packages have a lead-free
second level interconnect. The category of
second level interconnect is marked on the
package and on the inner box label, in
compliance with JEDEC Standard JESD97. The
■
maximum ratings related to soldering conditions
are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK®
specifications are available at www.st.com.