D13002F16V Renesas Electronics America, D13002F16V Datasheet - Page 70
D13002F16V
Manufacturer Part Number
D13002F16V
Description
IC H8/3002 ROMLESS 100QFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet
1.D13002F16V.pdf
(702 pages)
Specifications of D13002F16V
Core Processor
H8/300H
Core Size
16-Bit
Speed
16MHz
Connectivity
SCI
Peripherals
DMA, PWM, WDT
Number Of I /o
38
Program Memory Type
ROMless
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-QFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
D13002F16V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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2.9 Basic Operational Timing
2.9.1 Overview
The H8/300H CPU operates according to the system clock (ø). The interval from one rise of the
system clock to the next rise is referred to as a “state.” A memory cycle or bus cycle consists of
two or three states. The CPU uses different methods to access on-chip memory, the on-chip
supporting modules, and the external address space. Access to the external address space can be
controlled by the bus controller.
2.9.2 On-Chip Memory Access Timing
On-chip memory is accessed in two states. The data bus is 16 bits wide, permitting both byte and
word access. Figure 2-15 shows the on-chip memory access cycle. Figure 2-16 indicates the pin
states.
ø
Internal address bus
Internal read signal
Internal data bus
(read access)
Internal write signal
Internal data bus
(write access)
Figure 2-15 On-Chip Memory Access Cycle
T state
1
53
Bus cycle
Address
Read data
Write data
T state
2
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