PIC16F818-I/P Microchip Technology, PIC16F818-I/P Datasheet - Page 29

IC MCU FLASH 1KX14 18-DIP

PIC16F818-I/P

Manufacturer Part Number
PIC16F818-I/P
Description
IC MCU FLASH 1KX14 18-DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F818-I/P

Program Memory Type
FLASH
Program Memory Size
1.75KB (1K x 14)
Package / Case
18-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
16
Eeprom Size
128 x 8
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
I2C/SPI/SSP
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
16
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014
Minimum Operating Temperature
- 40 C
On-chip Adc
5-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
ACICE0202 - ADAPTER MPLABICE 18P 300 MILAC164010 - MODULE SKT PROMATEII DIP/SOIC
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F818-I/P
Manufacturer:
Microchip Technology
Quantity:
295
1.8
1997 Microchip Technology Inc.
Related Application Notes
This section lists application notes that are related to this section of the manual. These applica-
tion notes may not be written specifically for the PIC16CXXX Mid-Range MCU family (that is they
may be written for the Base-Line, or the High-End families), but the concepts are pertinent, and
could be used (with modification and possible limitations). The current application notes related
to an introduction to Microchip’s PICmicro MCUs are:
Title
A Comparison of Low End 8-bit Microcontrollers
PIC16C54A EMI Results
Continuous Improvement
Improving the Susceptibility of an Application to ESD
Plastic Packaging and the Effects of Surface Mount Soldering Techniques
Section 1. Introduction
Application Note #
DS31001A-page 1-17
AN520
AN577
AN503
AN595
AN598
1

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