PIC16F818-I/P Microchip Technology, PIC16F818-I/P Datasheet - Page 514

• Manufacturer Part Number: PIC16F818-I/P
• Description: IC MCU FLASH 1KX14 18-DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F818-I/P

• Program Memory Type: FLASH
• Program Memory Size: 1.75KB (1K x 14)
• Package / Case: 18-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SPI
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 16
• Eeprom Size: 128 x 8
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Data Converters: A/D 5x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 128 B
• Interface Type: I2C/SPI/SSP
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 16
• Number Of Timers: 3
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 5-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: ACICE0202 - ADAPTER MPLABICE 18P 300 MILAC164010 - MODULE SKT PROMATEII DIP/SOIC
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PICmicro MID-RANGE MCU FAMILY
28.4
28.5
DS31028A-page 28-6
Programmer
Programming Environment
The second consideration is the programmer. PIC16CXXX MCUs only use serial programming
and therefore all programmers supporting these devices will support ICSP. One issue with the
programmer is the drive capability. As discussed before, it must be able to provide the specified
rise rates on the ICSP signals and also provide enough current to power the application circuit.
Figure 28-2
cuitry for RB6 and RB7. It is recommended that an evaluation be performed to determine if buff-
ering is required. Another issue with the programmer is what V
memory contents of the PICmicro. For instance, the PRO MATE II verifies program memory at
the minimum and maximum V
duction quality programmer. On the other hand, the PICSTART
for prototyping use only. The Microchip programming specifications state that the program mem-
ory contents should be verified at both the minimum and maximum V
circuit will be operating. This implies that the application circuit must be able to handle the varying
V
There are also several third party programmers that are available. You should select a program-
mer based on the features it has and how it fits into your programming environment. The Micro-
chip Development Systems Ordering Guide (DS30177) provides detailed information on all our
development tools. The Microchip Third Party Guide (DS00104) provides information on all of our
third party tool developers. Please consult these two references when selecting a programmer.
Many options exist including serial or parallel PC host connection, stand-alone operation, and
single or gang programmers. Some of the third party developers include Advanced Transdata
Corporation, BP Microsystems, Data I/O, Emulation Technology and Logical Devices.
The programming environment will affect the type of programmer used, the programmer cable
length, and the application circuit interface. Some programmers are well suited for a manual
assembly line while others are desirable for an automated assembly line. You may want to choose
a gang programmer to program multiple systems at a time.
The physical distance between the programmer and the application circuit affects the load capac-
itance on each of the programming signals. This will directly affect the drive strength needed to
provide the correct signal rise rates and current. This programming cable must also be as short
as possible and properly terminated and shielded, or the programming signals may be corrupted
by ringing or noise.
Finally, the application circuit interface to the programmer depends on the size constraints of the
application circuit itself and the assembly line. A simple header can be used to interface the appli-
cation circuit to the programmer. This might be more desirable for a manual assembly line where
a technician plugs the programmer cable into the board. A different method is the use of spring
loaded test pins (commonly referred to as pogo pins). The application circuit has pads on the
board for each of the programming signals. Then there is a fixture that has pogo pins in the same
configuration as the pads on the board. The application circuit or fixture is moved into position
such that the pogo pins come into contact with the board. This method might be more suitable
for an automated assembly line.
After taking into consideration the issues with the application circuit, the programmer, and the
programming environment, anyone can build a high quality, reliable manufacturing line based on
ICSP.
DD
voltages.
shows an example driver board. This driver schematic does not show any buffer cir-
DD
levels for the specified device and is therefore considered a pro-
®
DD
Plus only verifies at 5V and is
1997 Microchip Technology Inc.
levels are used to verify the
DD
levels that the application