PIC16F818-I/P Microchip Technology, PIC16F818-I/P Datasheet - Page 666

• Manufacturer Part Number: PIC16F818-I/P
• Description: IC MCU FLASH 1KX14 18-DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F818-I/P

• Program Memory Type: FLASH
• Program Memory Size: 1.75KB (1K x 14)
• Package / Case: 18-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SPI
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 16
• Eeprom Size: 128 x 8
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Data Converters: A/D 5x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 128 B
• Interface Type: I2C/SPI/SSP
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 16
• Number Of Timers: 3
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 5-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: ACICE0202 - ADAPTER MPLABICE 18P 300 MILAC164010 - MODULE SKT PROMATEII DIP/SOIC
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PICmicro MID-RANGE MCU FAMILY
C.2
DS31034A-page 34-14
SSP (Synchronous Serial Port) Module
The SSP module has two modes of operation;
• SPI (Serial Peripheral Interface)
• I
There are now three different SSP modules that exist in Microchip’s design library. The first SSP
module (now called Basic SSP) implements two of the four SPI modes, and the I
slave mode. The second SSP module (called SSP) implements all four SPI modes, and the I
module in slave mode. The third SSP module (called Master SSP) implements all four SPI
modes, and the I
an SSP module and denotes which version is implemented. As new devices are introduced,
either the SSP module or Master SSP module will be implemented (that is, the Basic SSP mod-
ule is being phased out). Only select devices will be introduced with the Master SSP module due
to the size (silicon area => cost) difference in relation to the SSP module. If your application
requires I
PIC17CXXX.
Table C-1:
PIC16C62
PIC16C62A
PIC16CR62
PIC16C63
PIC16CR63
PIC16C64
PIC16C64A
PIC16CR64
PIC16C65
PIC16C65A
PIC16CR65
PIC16C66
PIC16C67
PIC16C72
PIC16CR72
PIC16C73
PIC16C73A
PIC16C74
PIC16C74A
PIC16C76
PIC16C77
PIC16C923
PIC16C924
Future Devices with SSP
module
Note 1: At present NO midrange devices are available with the Master SSP module. Please
2
C (Inter-Integrated Circuit).
2
C Master mode, then you should also check into Microchip’s high-end family,
Device
refer to Microchip’s Web site or BBS for release of Product Briefs. You will be able to
find out the details of features for new devices.
This module is available on Microchip’s High End family (PIC17CXXX). Please
refer to Microchip’s Web site, BBS, Regional Sales Office, or Factory Repre-
sentatives.
2
Devices With an SSP module
C module in master and slave modes.
See Device
Data Sheet
SSP
Yes
Yes
Yes
Yes
Yes
Yes
Yes
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Synchronous Serial Port Version
Basic SSP
Table C-1
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
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1997 Microchip Technology Inc.
shows the devices that have
Master SSP
See Device
Data Sheet
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2
C module in
(1)
2
C