PIC18F45K22-I/P Microchip Technology, PIC18F45K22-I/P Datasheet - Page 426
PIC18F45K22-I/P
Manufacturer Part Number
PIC18F45K22-I/P
Description
MCU 8BIT 32KB FLASH 5.5V 40PDIP
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr
Datasheets
1.PIC16F722-ISS.pdf
(8 pages)
2.PIC18F26J13-ISS.pdf
(496 pages)
3.PIC18F25K22T-ISS.pdf
(10 pages)
Specifications of PIC18F45K22-I/P
Program Memory Type
FLASH
Program Memory Size
32KB (16K x 16)
Package / Case
40-DIP (0.600", 15.24mm)
Core Processor
PIC
Core Size
8-Bit
Speed
64MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
35
Eeprom Size
256 x 8
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 30x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
1536 B
Interface Type
I2C, SPI, EUSART
Maximum Clock Frequency
64 MHz
Number Of Programmable I/os
36
Number Of Timers
7
Operating Supply Voltage
1.8 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164005
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 28 Channel
On-chip Dac
5 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18F45K22-I/P
Manufacturer:
MICROCHIP
Quantity:
3 400
Part Number:
PIC18F45K22-I/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Company:
Part Number:
PIC18F45K22-I/PT
Manufacturer:
SST
Quantity:
3 400
Company:
Part Number:
PIC18F45K22-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC18F45K22-I/PT
Manufacturer:
MIC
Quantity:
20 000
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PIC18(L)F2X/4XK22
27.2
DS41412D-page 426
D017
D018
Note 1:
Param
PIC18LF2X/4XK22
PIC18F2X/4XK22
No.
2:
3:
DC Characteristics: Power-Down Current, PIC18(L)F2X/4XK22 (Continued)
DAC
FVR
Device Characteristics
The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
BOR, HLVD and FVR enable internal band gap reference. With both modules enabled, current consump-
tion will be less than the sum of both specifications.
A/D converter differential currents apply only in Run mode. In Sleep or Idle mode both the ADC and the
FRC turn off as soon as conversion (if any) is complete.
Standard Operating Conditions (unless otherwise stated)
Operating temperature
Standard Operating Conditions (unless otherwise stated)
Operating temperature
+25°C
Typ
12
20
12
20
33
15
15
30
35
70
+60°C
Typ
Preliminary
+85°C
Max
100
20
30
20
30
50
25
25
45
55
+125°C
-40°C T
-40°C T
Max
100
20
30
20
30
50
25
25
45
55
A
A
Units
A
A
A
A
A
A
A
A
A
A
+125°C
+125°C
1.8V
3.0V
1.8V
3.0V
5.0V
1.8V
3.0V
1.8V
3.0V
5.0V
V
DD
2010 Microchip Technology Inc.
Conditions
Notes
DD
or V
SS
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