PIC16C55-XTI/SS Microchip Technology, PIC16C55-XTI/SS Datasheet - Page 179

• Manufacturer Part Number: PIC16C55-XTI/SS
• Description: IC MCU OTP 512X12 28SSOP
• Manufacturer: Microchip Technology
• Series: PIC® 16Cr

Specifications of PIC16C55-XTI/SS

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Peripherals: POR, WDT
• Number Of I /o: 20
• Program Memory Size: 768B (512 x 12)
• Program Memory Type: OTP
• Ram Size: 24 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 6.25 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SSOP
• For Use With: 309-1026 - ADAPTER 28-SSOP TO 28-DIP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Connectivity: -

28-Lead Plastic Small Outline (SO) – Wide, 300 mil (SOIC)
2002 Microchip Technology Inc.
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-052
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle Top
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
c
p
n
45
E1
E
Dimension Limits
h
Units
A2
A1
E1
E
D
B
n
p
A
h
L
c
2
1
D
L
MIN
Preliminary
.093
.088
.004
.394
.288
.695
.010
.016
.009
.014
0
0
0
A1
INCHES*
A
NOM
.050
.099
.008
.407
.295
.704
.020
.033
.017
.091
.011
28
12
12
4
MAX
.104
.094
.012
.420
.299
.712
.029
.050
.013
.020
15
15
8
MIN
17.65
10.01
2.36
2.24
0.10
0.25
0.23
0.36
7.32
0.41
0
0
0
MILLIMETERS
NOM
10.34
17.87
PIC16C5X
1.27
2.50
0.20
7.49
0.50
0.84
0.28
0.42
2.31
28
12
12
4
DS30453D-page 177
MAX
A2
10.67
18.08
2.64
2.39
0.30
7.59
0.74
1.27
0.33
0.51
15
15
8