PIC16C55-XTI/SS Microchip Technology, PIC16C55-XTI/SS Datasheet - Page 182

• Manufacturer Part Number: PIC16C55-XTI/SS
• Description: IC MCU OTP 512X12 28SSOP
• Manufacturer: Microchip Technology
• Series: PIC® 16Cr

Specifications of PIC16C55-XTI/SS

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Peripherals: POR, WDT
• Number Of I /o: 20
• Program Memory Size: 768B (512 x 12)
• Program Memory Type: OTP
• Ram Size: 24 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 6.25 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SSOP
• For Use With: 309-1026 - ADAPTER 28-SSOP TO 28-DIP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Connectivity: -

PIC16C5X
18-Lead Ceramic Dual In-line with Window (JW) – 300 mil (CERDIP)
DS30453D-page 180
Number of Pins
Pitch
Top to Seating Plane
Ceramic Package Height
Standoff
Shoulder to Shoulder Width
Ceramic Pkg. Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Window Width
Window Length
* Controlling Parameter
§ Significant Characteristic
JEDEC Equivalent: MO-036
Drawing No. C04-010
W2
n
E1
W1
eB
E
Dimension Limits
§
2
1
Units
W2
eB
W1
D
A2
A1
E1
B1
D
n
p
A
E
L
c
B
c
A1
A
MIN
Preliminary
.170
.155
.015
.300
.285
.880
.125
.008
.050
.016
.345
.130
.190
INCHES*
NOM
.100
.183
.160
.023
.313
.290
.900
.138
.010
.055
.019
.385
.140
.200
18
B
B1
MAX
.195
.165
.030
.325
.295
.920
.150
.060
.425
.150
.210
.012
.021
MIN
22.35
4.32
3.94
0.38
7.62
7.24
3.18
0.20
1.27
8.76
3.30
4.83
0.41
MILLIMETERS
p
NOM
2002 Microchip Technology Inc.
22.86
A2
2.54
4.64
4.06
0.57
7.94
7.37
3.49
0.25
1.40
0.47
9.78
3.56
5.08
18
L
MAX
23.37
10.80
4.95
4.19
0.76
8.26
7.49
0.30
1.52
0.53
5.33
3.81
3.81