DSPIC30F4013-20E/PT Microchip Technology, DSPIC30F4013-20E/PT Datasheet - Page 38

IC DSPIC MCU/DSP 48K 44TQFP

DSPIC30F4013-20E/PT

Manufacturer Part Number
DSPIC30F4013-20E/PT
Description
IC DSPIC MCU/DSP 48K 44TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr

Specifications of DSPIC30F4013-20E/PT

Program Memory Type
FLASH
Program Memory Size
48KB (16K x 24)
Package / Case
44-TQFP, 44-VQFP
Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, I²S, POR, PWM, WDT
Number Of I /o
30
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 13x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC30F
Core
dsPIC
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
30
Data Ram Size
2 KB
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300018, DM330011
Minimum Operating Temperature
- 40 C
Package
44TQFP
Device Core
dsPIC
Family Name
dsPIC30
Maximum Speed
20 MHz
Operating Supply Voltage
3.3|5 V
Interface Type
CAN/I2C/SPI/UART
On-chip Adc
13-chx12-bit
Number Of Timers
5
Core Frequency
20MHz
Embedded Interface Type
CAN, I2C, SPI, UART
No. Of I/o's
30
Flash Memory Size
48KB
Supply Voltage Range
2.5V To 5.5V
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC30F006 - MODULE SKT FOR DSPIC30F 44TQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
DSPIC30F401320EPT

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F4013-20E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Table 11-4
bulk-erasing program memory. This process includes
the ICSP command code, which must be transmitted
(for each instruction) to the Least Significant bit first
using the PGC and PGD pins (see
If an individual Segment Erase operation is required,
the NVMCON value must be replaced by the value for
the corresponding Segment Erase operation.
TABLE 11-4:
DS70102K-page 38
Step 1: Exit the Reset vector.
0000
0000
0000
Step 2: Set NVMCON to program the FBS Configuration register.
0000
0000
Step 3: Initialize the TBLPAG and write pointer (W7) for TBLWT instruction for Configuration register.
0000
0000
0000
Step 4: Load the Configuration Register data to W6.
0000
0000
Step 5: Load the Configuration Register write latch. Advance W7 to point to next Configuration register.
0000
Step 6: Unlock the NVMCON for programming the Configuration register.
0000
0000
0000
0000
Step 7: Initiate the programming cycle.
0000
0000
0000
0000
0000
0000
0000
0000
Step 8: Repeat steps 5-7 one time to program 0x0000 to RESERVED2 Configuration register.
Step 9: Set the NVMCON to erase all Program Memory.
00000
0000
Step 10: Unlock the NVMCON for programming.
Note 1:
Command
Note:
(Binary)
shows the ICSP programming process for
Steps 2-8 are only required for the dsPIC30F5011/5013 devices. These steps may be skipped for all other
devices in the dsPIC30F family.
Program memory must be erased before
writing any data to program memory.
040100
040100
000000
24008A
883B0A
200F80
880190
200067
EB0300
000000
BB1B86
200558
200AA9
883B38
883B39
A8E761
000000
000000
000000
000000
A9E761
000000
000000
2407FA
883B0A
(Hexadecimal)
SERIAL INSTRUCTION EXECUTION FOR BULK ERASING PROGRAM MEMORY
(ONLY IN NORMAL-VOLTAGE SYSTEMS)
Data
Figure
GOTO 0x100
GOTO 0x100
NOP
MOV
MOV
MOV
MOV
MOV
CLR
NOP
TBLWTL W6, [W7++]
MOV
MOV
MOV
MOV
BSET NVMCON, #WR
NOP
NOP
Externally time 2 ms
NOP
NOP
BCLR NVMCON, #WR
NOP
NOP
MOV
MOV
(1)
11-2).
#0x55, W8
#0xAA, W9
W8, NVMKEY
W9, NVMKEY
#0x4008, W10
W10, NVMCON
#0xF8, W0
W0, TBLPAG
#0x6, W7
W6
#0x407F, W10
W10, NVMCON
(1)
(1)
Description
(1)
© 2010 Microchip Technology Inc.
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