PIC24FJ64GB002-I/ML Microchip Technology, PIC24FJ64GB002-I/ML Datasheet - Page 23

• Manufacturer Part Number: PIC24FJ64GB002-I/ML
• Description: IC MCU 16BIT 64KB FLASH 28QFN
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 24Fr

Specifications of PIC24FJ64GB002-I/ML

• Program Memory Type: FLASH
• Program Memory Size: 64KB (22K x 24)
• Package / Case: 28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I²C, IrDA, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 19
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 9x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC24FJ
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 8 KB
• Interface Type: I2C/IrDA/SPI/UART
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 19
• Number Of Timers: 5
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DM240011
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 9-ch x 10-bit
• Controller Family/series: PIC24
• Ram Memory Size: 8KB
• Cpu Speed: 32MHz
• No. Of Timers: 5
• Embedded Interface Type: I2C, LIN, SPI, UART, USB
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

APPENDIX A:
Revision E (September 2008)
The following is the list of modifications:
1.
2.
3.
4.
5.
6.
7.
8.
Revision D (April 2008)
The following is the list of modifications:
1.
Revision C (October 2007)
The following is the list of modifications:
1.
2.
3.
Revision B (March 2006)
The following is the list of modifications:
1.
Revision A (November 2005)
• Original Release of this Document.
© 2008 Microchip Technology Inc.
Package Types: Changed DFN pinout diagram.
1.0 “Electrical Characteristics”: Changed
“Charge Impedance Range from 20 kΩ to
67 kΩ.
1.0 “Electrical Characteristics”: Misc. Format-
ting changes.
Section 2.0 “Typical Performance Curves”:
Updated Figure 2-4.
Section 3.0
Exposed
Section 3.6 “Exposed Thermal Pad (EP)”.
Updated Appendix A: “Revision History”
Added Land Patttern Package Outline Drawing
for 2x3 DFN package.
Pagination fixes throughout document per
Marcom Standards.
Changed Charge Termination Current Ratio to
8.5% minimum and 11.5% maximum.
Numerous edits throughout document.
Added note to Temperature Specifications table.
Updated Figure 2-4.
Added MCP73832 through document.
Pad
“Pin
pin
REVISION HISTORY
Description”:
to
table
and
Added
added
MCP73831/2
DS21984E-page 19