PIC16C66-20E/SP Microchip Technology, PIC16C66-20E/SP Datasheet - Page 185
![IC MCU OTP 8KX14 PWM 28DIP](/photos/6/59/65908/150-28-dip_sml.jpg)
PIC16C66-20E/SP
Manufacturer Part Number
PIC16C66-20E/SP
Description
IC MCU OTP 8KX14 PWM 28DIP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F818-ISO.pdf
(6 pages)
3.PIC16LC62A-04SP.pdf
(337 pages)
4.PIC16C66-04SO.pdf
(6 pages)
Specifications of PIC16C66-20E/SP
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Program Memory Size
14KB (8K x 14)
Program Memory Type
OTP
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 6 V
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
28-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
- PIC16F616T-ISL PDF datasheet
- PIC16F818-ISO PDF datasheet #2
- PIC16LC62A-04SP PDF datasheet #3
- PIC16C66-04SO PDF datasheet #4
- Current page: 185 of 337
- Download datasheet (3Mb)
18.2
DC CHARACTERISTICS
D001
D002*
D003
D004*
D010
D010A
D020
D021
D021A
Note 1: This is the limit to which V
Param
1997 Microchip Technology Inc.
No.
*
†
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti-
5: Timer1 oscillator (when enabled) adds approximately 20 A to the specification. This value is from charac-
These parameters are characterized but not tested.
Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only
and are not tested.
DC Characteristics:
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all I
OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to V
MCLR = V
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
mated by the formula Ir = V
terization and is for design guidance only. This is not tested.
Supply Voltage
RAM Data Retention
Voltage (Note 1)
V
ensure internal Power-
on Reset signal
V
internal Power-on
Reset signal
Supply Current
(Note 2, 5)
Power-down Current
(Note 3, 5)
DD
DD
Characteristic
start voltage to
rise rate to ensure
DD
; WDT enabled/disabled as specified.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Standard Operating Conditions (unless otherwise stated)
Operating temperature
DD
DD
PIC16LC62/64-04 (Commercial, Industrial)
V
V
S
I
I
V
DD
PD
Sym
DD
DD
DR
POR
VDD
can be lowered without losing RAM data.
measurements in active operation mode are:
/2Rext (mA) with Rext in kOhm.
0.05
Min
3.0
-
-
-
-
-
-
-
Typ† Max Units
22.5
V
1.5
2.0
7.5
0.9
0.9
-
SS
-
13.5
6.0
3.8
48
30
18
0˚C
-
-
-
-40˚C
V/ms See section on Power-on Reset for details
mA
V
V
V
A
A
A
A
T
T
LP, XT, RC osc configuration (DC - 4 MHz)
See section on Power-on Reset for details
XT, RC osc configuration
F
LP osc configuration
F
V
V
V
A
A
OSC
OSC
DD
DD
DD
+85˚C for industrial and
+70˚C for commercial
= 3.0V, WDT enabled, -40 C to +85 C
= 3.0V, WDT disabled, 0 C to +70 C
= 3.0V, WDT disabled, -40 C to +85 C
= 4 MHz, V
= 32 kHz, V
DD
Conditions
DD
DD
PIC16C6X
= 3.0V (Note 4)
= 3.0V, WDT disabled
DS30234D-page 185
DD
and V
SS
.
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