ATMEGA325V-8AU Atmel, ATMEGA325V-8AU Datasheet - Page 3
ATMEGA325V-8AU
Manufacturer Part Number
ATMEGA325V-8AU
Description
IC AVR MCU 32K 8MHZ 64TQFP
Manufacturer
Atmel
Series
AVR® ATmegar
Specifications of ATMEGA325V-8AU
Core Processor
AVR
Core Size
8-Bit
Speed
8MHz
Connectivity
SPI, UART/USART, USI
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
54
Program Memory Size
32KB (16K x 16)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-TQFP, 64-VQFP
For Use With
ATSTK600-TQFP64 - STK600 SOCKET/ADAPTER 64-TQFP770-1007 - ISP 4PORT ATMEL AVR MCU SPI/JTAG770-1005 - ISP 4PORT FOR ATMEL AVR MCU JTAG770-1004 - ISP 4PORT FOR ATMEL AVR MCU SPIATAVRISP2 - PROGRAMMER AVR IN SYSTEM
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ATMEGA325V-8AU
Manufacturer:
IXYS
Quantity:
230
Company:
Part Number:
ATMEGA325V-8AU
Manufacturer:
ATMEL
Quantity:
52
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Figure 1-2.
2570M–AVR–04/11
(USCK/SCL/PCINT4) PE4
(XCK/AIN0/PCINT2) PE2
(DI/SDA/PCINT5) PE5
(OC1A/PCINT13) PB5
(OC1B/PCINT14) PB6
(OC0A/PCINT12) PB4
(MOSI/PCINT10) PB2
(MISO/PCINT11) PB3
(CLKO/PCINT7) PE7
(AIN1/PCINT3) PE3
(RXD/PCINT0) PE0
(SCK/PCINT9) PB1
(TXD/PCINT1) PE1
(DO/PCINT6) PE6
(SS/PCINT8) PB0
Pinout ATmega325/645
DNC
Note:
10
11
12
14
15
16
13
1
2
3
4
5
6
7
8
9
The large center pad underneath the QFN/MLF packages is made of metal and internally con-
nected to GND. It should be soldered or glued to the board to ensure good mechanical stability. If
the center pad is left unconnected, the package might loosen from the board.
INDEX CORNER
ATmega325/645
ATmega325/3250/645/6450
39
38
35
34
33
48
47
46
45
44
43
42
41
40
37
36
PA3
PA4
PA5
PA6
PA7
PG2
PC7
PC6
PC5
PC4
PC3
PC2
PC1
PC0
PG1
PG0
3
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