LPC3152FET208,551 NXP Semiconductors, LPC3152FET208,551 Datasheet - Page 12

• Manufacturer Part Number: LPC3152FET208,551
• Description: IC ARM9 MCU USB OTG 208TFBGA
• Manufacturer: NXP Semiconductors
• Series: LPC3000r

Specifications of LPC3152FET208,551

• Package / Case: 208-TFBGA
• Core Processor: ARM9
• Core Size: 32-Bit
• Speed: 180MHz
• Connectivity: EBI/EMI, I²C, IrDA, MMC, PCM, SPI, UART/USART, USB OTG
• Peripherals: DMA, I²S, LCD, PWM, WDT
• Number Of I /o: 10
• Program Memory Type: ROMless
• Ram Size: 192K x 8
• Voltage - Supply (vcc/vdd): 1.1 V ~ 3.6 V
• Data Converters: A/D 3x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC31
• Core: ARM926EJS
• Data Bus Width: 32 bit
• Data Ram Size: 192 KB
• Interface Type: I2C, I2S, SPI, UART
• Maximum Clock Frequency: 180 MHz
• Number Of Timers: 5
• Operating Supply Voltage: 1.2 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: OM11029
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 935287561551

NXP Semiconductors
Table 4.
Pin names with prefix m are multiplexed pins. See
LPC3152_3154
Preliminary data sheet
TFBGA pin name
EBI_D_14
EBI_D_15
EBI_DQM_0_NOE
EBI_NWE
NAND_NCS_0
NAND_NCS_1
NAND_NCS_2
NAND_NCS_3
mNAND_RYBN0
mNAND_RYBN1
mNAND_RYBN2
mNAND_RYBN3
EBI_NCAS_BLOUT_0
EBI_NRAS_BLOUT_1
Secure one time programmable memory
VPP
Real Time Clock (RTC)
RTC_VDD36
RTC_VSS
FSLOW_OUT
FSLOW_IN
RTC_INT
RTC_BACKUP
RTC_CLK32
Power supply unit
PSU_VBUS
PSU_VOUT1
PSU_LX1
PSU_LX2
PSU_VSS1
PSU_VIN1
PSU_VOUT2
PSU_VOUT3
PSU_VSSA
PSU_VSSA_CLEAN
PSU_PLAY
[7]
[4]
[4]
[4]
Pin description
[4]
[4]
[4]
[4]
[4]
[4]
[4]
[4]
[4]
[4]
[4]
TFB
GA
ball
G2
H2
K3
K4
L2
L3
L4
M2
B5
C5
D5
D4
J2
J4
C9
L15
M17
L16
L17
M16
K14
U17
J16
H14
H15
G17
H16
G16
G14
E17
D16
D17
C17
…continued
Digital
I/O
level
[1]
SUP4
SUP4
SUP4
SUP4
SUP4
SUP4
SUP4
SUP4
SUP4
SUP4
SUP4
SUP4
SUP4
SUP4
SUP1/
SUP3
SUP6
-
SUP7
SUP7
SUP6
SUP7
SUP6
SUP5
SUP3
-
-
-
-
SUP1
SUP2
-
-
SUP3
All information provided in this document is subject to legal disclaimers.
Application
function
DIO
DIO
DO
DO
DO
DO
DO
DO
DI
DI
DI
DI
DO
DO
Supply
Supply
Ground
AO
AI
DO
Supply
AO
Supply
AO
AIO
AIO
Ground
AI
AO
AO
Ground
Ground
AI
Rev. 0.12 — 27 May 2010
Table 11
Pin
state
after
reset
I
I
O
O
O
O
O
O
I
I
I
I
O
O
O
O
I
for pin function selection of multiplexed pins.
[2]
Cell type
[3]
DIO4
DIO4
DIO4
DIO4
DIO4
DIO4
DIO4
DIO4
DIO4
DIO4
DIO4
DIO4
DIO4
DIO4
PS3
CS1
CG1
AIO2
AIO2
AIO2
CS1
AIO2
CS1
CS1
CS1
CS1
CG1
CS1
CS1
CS1
CG1
CG1
AIO2
Description
EBI Data I/O 14
EBI Data I/O 15
EBI read enable (active LOW)
EBI write enable (active LOW)
EBI chip enable 0
EBI chip enable 1
EBI chip enable 2
EBI chip enable 3
EBI NAND ready/busy 0
EBI NAND ready/busy 1
EBI NAND ready/busy 2
EBI NAND ready/busy 3
EBI lower lane byte select (7:0)
EBI upper lane byte select (15:8)
Supply for polyfuse programming
RTC supply connected to battery
RTC ground
RTC 32.768 kHz clock output
RTC 32.768 kHz clock input
RTC interrupt (HIGH active)
RTC backup capacitor connection
RTC 32 kHz clock output for on-board
applications such as tuner
PSU USB supply voltage
PSU output1
PSU external coil terminal for output1
PSU external coil terminal for output2
PSU ground
PSU output1 input voltage
PSU output2
PSU output3
PSU ground
PSU reference circuit ground
PSU play button input (active HIGH)
LPC3152/3154
© NXP B.V. 2010. All rights reserved.
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