LPC3152FET208,551 NXP Semiconductors, LPC3152FET208,551 Datasheet - Page 81

• Manufacturer Part Number: LPC3152FET208,551
• Description: IC ARM9 MCU USB OTG 208TFBGA
• Manufacturer: NXP Semiconductors
• Series: LPC3000r

Specifications of LPC3152FET208,551

• Package / Case: 208-TFBGA
• Core Processor: ARM9
• Core Size: 32-Bit
• Speed: 180MHz
• Connectivity: EBI/EMI, I²C, IrDA, MMC, PCM, SPI, UART/USART, USB OTG
• Peripherals: DMA, I²S, LCD, PWM, WDT
• Number Of I /o: 10
• Program Memory Type: ROMless
• Ram Size: 192K x 8
• Voltage - Supply (vcc/vdd): 1.1 V ~ 3.6 V
• Data Converters: A/D 3x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC31
• Core: ARM926EJS
• Data Bus Width: 32 bit
• Data Ram Size: 192 KB
• Interface Type: I2C, I2S, SPI, UART
• Maximum Clock Frequency: 180 MHz
• Number Of Timers: 5
• Operating Supply Voltage: 1.2 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: OM11029
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 935287561551

NXP Semiconductors
13. Package outline
Fig 35. LPC3152/3154 TFBGA208 package outline
LPC3152_3154
Preliminary data sheet
TFBGA208: plastic thin fine-pitch ball grid array package; 208 balls; body 12 x 12 x 0.7 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
VERSION
SOT930-1
OUTLINE
max
1.15
ball A1
index area
ball A1
index area
A
0.35
0.25
A
M
K
H
D
B
T
P
F
1
G
U
R
N
L
J
E
C
A
0.80
0.65
1
A
2
2
IEC
3
4
0.45
0.35
b
5
e
6
7
12.1
11.9
D
8
e
D
9
1
10
JEDEC
12.1
11.9
All information provided in this document is subject to legal disclaimers.
11
E
- - -
12
REFERENCES
13
0
0.65
14
e
15
Rev. 0.12 — 27 May 2010
b
16
10.4
17
e
1
JEITA
10.4
scale
e
2
e
5
B
∅ v
∅ w
0.15
e
E
A
2
v
M
M
C
C
0.05
A
w
B
10 mm
0.08
y
A
A
2
0.1
y
1
A
y
1
1
C
PROJECTION
EUROPEAN
LPC3152/3154
detail X
C
X
y
© NXP B.V. 2010. All rights reserved.
ISSUE DATE
05-12-08
06-01-03
SOT930-1
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