STM32F103RBH6 STMicroelectronics, STM32F103RBH6 Datasheet - Page 95

• Manufacturer Part Number: STM32F103RBH6
• Description: MCU ARM 32BIT 128KB FLASH 64BGA
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F103RBH6

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
• Peripherals: DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
• Number Of I /o: 51
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 20K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-BGA
• Processor Series: STM32F103x
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 20 KB
• Interface Type: CAN, I2C, SPI, USART, USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 51
• Number Of Timers: 3
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWARM, EWARM-BL, KSDK-STM32-PLUS, KSK-STM32-JL, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: ST-LINK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 2 (12 bit, 16 Channel)
• Featured Product: STM32 Cortex-M3 Companion Products
• Eeprom Size: -
• For Use With: 497-10048 - BOARD EVAL ACCELEROMETER497-10030 - STARTER KIT FOR STM32KSDKSTM32-PL - KIT IAR KICKSTART STM32 CORTEXM3497-8512 - KIT STARTER FOR STM32F10XE MCU497-8511 - KIT STARTER FOR STM32 512K FLASH497-8505 - KIT STARTER FOR STM32F10XE MCU497-8418 - BOARD DEMO DGTL PHOTOFRAME STM32497-6438 - BOARD EVALUTION FOR STM32 512K497-6289 - KIT PERFORMANCE STICK FOR STM32MCBSTM32UME - BOARD EVAL MCBSTM32 + ULINK-MEMCBSTM32U - BOARD EVAL MCBSTM32 + ULINK2MCBSTM32 - BOARD EVAL FOR STM STM32X SER497-6053 - KIT STARTER FOR STM32497-6052 - KIT STARTER FOR STM32497-6050 - KIT STARTER FOR STM32497-6049 - KIT EVALUATION LOW COST STM32497-6048 - BOARD EVALUATION FOR STM32497-6047 - KIT DEVELOPMENT FOR STM32
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

STM32F103x8, STM32F103xB
Table 60.
22-May-2008
14-Mar-2008
21-Mar-2008
Date
Document revision history (continued)
Revision
5
6
7
Figure 2: Clock tree on page 12
Maximum T
page
CRC feature added (see
unit on page 9
I
Stop and Standby
ACC
note 2 removed.
P
in
t
V
page
Table 42: SPI characteristics on page 69
I
Table 48: ADC accuracy - limited test conditions
accuracy
LQFP100 package specifications updated (see
characteristics on page
Recommended LQFP100, LQFP 64, LQFP48 and VFQFPN36
footprints added (see
Section 6.2: Thermal characteristics on page 88
Section 6.2.1
Appendix A: Important notes on page 81
Small text changes.
In
– N
– cycling conditions specified for t
– t
V
CRC feature removed.
CRC feature added back. Small text changes.
modified.
I
current consumptions in Stop and Standby modes on page
I
Standby mode on page
Values added to
3.3 V) on page
Figure 32: SPI timing diagram - slave mode and CPHA = 0 on page 70
modified.
t
data retention on page
V
Figure 54: LQFP100 PD max vs. TA on page 90
Axx option added to
page
DD
RET
VREF
DD
DD_VBAT
RET
D
NF(NRST)
25
USB
Table 28: Flash memory characteristics on page
Table 29: Flash memory endurance and data
, T
RET
Doc ID 13587 Rev 13
, Avg_Slope and T
modified in
END
at T
HSI
modified in
at T
A
36.
65.
91.
added to
added to
and T
min modified at T
A
modified in
tested over the whole temperature range
A
removed from
max = 105 °C added to
modified.
Section 2.2: Full compatibility throughout the family
Equation 1
= 105 °C modified in
unit corrected in
J
J
value given in
added, t
and
and
Table 16: Typical and maximum current consumptions in
Table 44: USB DC electrical characteristics on page
68.
Table 46: ADC characteristics on page
Table 29: Flash memory endurance and data
Table 41: SCL frequency (fPCLK1= 36 MHz.,VDD =
Section 6.2.2
modes.
Figure 10: Memory map on page 32
Table 24: HSI oscillator characteristics on page
Figure 10: Memory map
Table 59: Ordering information scheme on
corrected.
Figure
prog
L
56.
modified in
Table 21: Typical current consumption in
78).
A
47.
CRC (cyclic redundancy check) calculation
= 55 °C
values modified and t
Table 38: NRST pin characteristics on
Table 8: Thermal characteristics on
47,
Changes
Table 29: Flash memory endurance and
added.
added.
Figure
Table 16: Typical and maximum
RET
Table 50: TS
49,
modified.
removed.
Figure 53
clarified.
Section 1: Introduction
prog
Section 6: Package
retention:
added.
characteristics.
modified.
modified,
55.
description clarified
Revision history
and
73.
Table 49: ADC
for address).
Figure
43.
added.
retention.
41).
95/99
53,
72.