STM32F103RBH6 STMicroelectronics, STM32F103RBH6 Datasheet - Page 97

• Manufacturer Part Number: STM32F103RBH6
• Description: MCU ARM 32BIT 128KB FLASH 64BGA
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F103RBH6

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
• Peripherals: DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
• Number Of I /o: 51
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 20K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-BGA
• Processor Series: STM32F103x
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 20 KB
• Interface Type: CAN, I2C, SPI, USART, USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 51
• Number Of Timers: 3
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWARM, EWARM-BL, KSDK-STM32-PLUS, KSK-STM32-JL, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: ST-LINK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 2 (12 bit, 16 Channel)
• Featured Product: STM32 Cortex-M3 Companion Products
• Eeprom Size: -
• For Use With: 497-10048 - BOARD EVAL ACCELEROMETER497-10030 - STARTER KIT FOR STM32KSDKSTM32-PL - KIT IAR KICKSTART STM32 CORTEXM3497-8512 - KIT STARTER FOR STM32F10XE MCU497-8511 - KIT STARTER FOR STM32 512K FLASH497-8505 - KIT STARTER FOR STM32F10XE MCU497-8418 - BOARD DEMO DGTL PHOTOFRAME STM32497-6438 - BOARD EVALUTION FOR STM32 512K497-6289 - KIT PERFORMANCE STICK FOR STM32MCBSTM32UME - BOARD EVAL MCBSTM32 + ULINK-MEMCBSTM32U - BOARD EVAL MCBSTM32 + ULINK2MCBSTM32 - BOARD EVAL FOR STM STM32X SER497-6053 - KIT STARTER FOR STM32497-6052 - KIT STARTER FOR STM32497-6050 - KIT STARTER FOR STM32497-6049 - KIT EVALUATION LOW COST STM32497-6048 - BOARD EVALUATION FOR STM32497-6047 - KIT DEVELOPMENT FOR STM32
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

STM32F103x8, STM32F103xB
Table 60.
22-Sep-2009
23-Apr-2009
03-Jun-2010
Date
Document revision history (continued)
Revision
10
11
12
I/O information clarified
Figure 3: STM32F103xx performance line LFBGA100 ballout
Figure 10: Memory map
added.
PB4, PB13, PB14, PB15, PB3/TRACESWO moved from Default
column to Remap column in
pin
P
Note modified in
mode, code with data processing running from Flash
Maximum current consumption in Sleep mode, code running from
Flash or
Table 20: High-speed external user clock characteristics
Low-speed external user clock characteristics
Figure 19
modified in
TFBGA64 package added (see
changes.
Note 5
STM32F103xx pin
V
voltage. I
current consumptions in Stop and Standby
current consumption on VBAT with RTC on versus temperature at
different VBAT values
f
characteristics.
C
characteristics
32.768
oscillator characteristics
Low-power mode wakeup
Note 1
crystal.
IEC 1000 standard updated to IEC 61000 and SAE J1752/3 updated to
IEC 61967-2 in
Jitter added to
Table 42: SPI characteristics
C
R
Figure 44: LFBGA100 - 10 x 10 mm low profile fine pitch ball grid array
package outline
Added STM32F103TB devices.
Added VFQFPN48 package.
Updated note 2 below
Updated
Updated
Updated
HSE_ext
D
RERINT
L1
ADC
AIN
for LFBGA100 corrected in
Doc ID 13587 Rev 13
definitions.
and C
max values modified in
and R
updated and
modified below
kHz), notes modified and moved below the tables.
min modified in
RAM.
and T
DD_VBAT
Figure 31: I2C bus AC waveforms and measurement circuit
Figure 30: Recommended NRST pin protection
Section 5.3.12: I/O current injection characteristics
shows a typical curve (title modified). ACC
L2
Table 24: HSI oscillator
AIN
replaced by C in
Coeff
Table 27: PLL
and
Section 5.3.10: EMC characteristics on page
parameters modified in
Table 13: Maximum current consumption in Run
updated.
value added to
definitions.
Table 23: LSE oscillator characteristics (fLSE =
added to
Note 4
added.
Table 40: I2C characteristics
Figure 23: Typical application with an 8 MHz
on page
Table 20: High-speed external user clock
modified.
modified. Conditions removed from
timings.
added in
Table 5: Medium-density STM32F103xx
Table 47: RAIN max for fADC = 14
Table 12: Embedded internal reference
modified.
characteristics.
Table 22: HSE 4-16 MHz oscillator
Changes
Table 9: General operating
Table 56
1.
Table 16: Typical and maximum
Table 4: Timer feature comparison
characteristics.
Table 5: Medium-density
Table 46: ADC
and
modes.
Table
modified.
50). Small text
Figure 17: Typical
Revision history
HSI
and
characteristics.
max values
and
Table 24: HSI
conditions.
Table 15:
Table 26:
Table 21:
56.
modified.
MHz.
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