ST72F264G2B6 STMicroelectronics, ST72F264G2B6 Datasheet - Page 142
![MCU 8-BIT 8K FLASH 32-SDIP](/photos/7/4/70414/497-32-sdip_series_sml.jpg)
ST72F264G2B6
Manufacturer Part Number
ST72F264G2B6
Description
MCU 8-BIT 8K FLASH 32-SDIP
Manufacturer
STMicroelectronics
Series
ST7r
Specifications of ST72F264G2B6
Mfg Application Notes
ST7 Checksum Capability, AN1070 App Note
Core Processor
ST7
Core Size
8-Bit
Speed
16MHz
Connectivity
I²C, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
22
Program Memory Size
8KB (8K x 8)
Program Memory Type
FLASH
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
32-SDIP (0.400", 10.16mm)
Processor Series
ST72F2x
Core
ST7
Data Bus Width
8 bit
Data Ram Size
256 B
Interface Type
I2C, SCI, SPI
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
22
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
Development Tools By Supplier
ST7F264-IND/USB, ST72F34X-SK/RAIS, ST7MDT10-DVP3, ST7MDT10-EMU3, STX-RLINK
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 6 Channel
For Use With
497-6423 - BOARD EVAL BASED ON ST72264G1497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Other names
497-5570
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ST72F264G2B6
Manufacturer:
ST
Quantity:
10
Company:
Part Number:
ST72F264G2B6
Manufacturer:
NEC
Quantity:
6 097
Part Number:
ST72F264G2B6
Manufacturer:
ST
Quantity:
20 000
ST72260Gx, ST72262Gx, ST72264Gx
EMC CHARACTERISTICS (Cont’d)
13.7.2 Electro Magnetic Interference (EMI)
Based on a simple application running on the
product (toggling 2 LEDs through the I/O ports),
the product is monitored in terms of emission. This
emission test is in line with the norm SAE J 1752/
3 which specifies the board and the loading of
each pin.
13.7.3 Absolute Maximum Ratings (Electrical
Sensitivity)
Based on three different tests (ESD, LU and DLU)
using specific measurement methods, the product
is stressed in order to determine its performance in
terms of electrical sensitivity. For more details, re-
fer to the application note AN1181.
Absolute Maximum Ratings
Notes:
1. Data based on characterization results, not tested in production.
142/172
Symbol
V
V
Symbol
ESD(HBM)
S
ESD(MM)
EMI
Peak level
Electro-static discharge voltage
(Human Body Model)
Electro-static discharge voltage
(Machine Model)
Parameter
Ratings
V
conforming to SAE J 1752/3
DD
=5V, T
Conditions
A
=+25°C,
T
T
A
A
=+25°C
=+25°C
13.7.3.1 Electro-Static Discharge (ESD)
Electro-Static Discharges (a positive then a nega-
tive pulse separated by 1 second) are applied to
the pins of each sample according to each pin
combination. The sample size depends on the
number of supply pins in the device (3 parts*(n+1)
supply pin). Two models can be simulated: Human
Body Model and Machine Model. This test con-
forms to the JESD22-A114A/A115A standard.
0.1MHz to 30MHz
30MHz to 130MHz
130MHz to 1GHz
SAE EMI Level
Frequency Band
Conditions
Monitored
Max vs. [f
8/4MHz
2.5
10
13
16
Maximum value
OSC
2000
200
16/8MHz
/f
13
24
31
4
CPU
]
1)
dBµV
Unit
Unit
-
V