STM32F103RBT7TR STMicroelectronics, STM32F103RBT7TR Datasheet - Page 64

• Manufacturer Part Number: STM32F103RBT7TR
• Description: MCU ARM 32BIT 64KB FLASH 64LQFP
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F103RBT7TR

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
• Peripherals: DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
• Number Of I /o: 51
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 20K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 64-LQFP
• Processor Series: STM32F103x
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 20 KB
• Interface Type: CAN, I2C, SPI, USART, USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 51
• Number Of Timers: 4
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWARM, EWARM-BL, KSDK-STM32-PLUS, KSK-STM32-JL, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: ST-LINK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 2 (12 bit, 16 Channel)
• For Use With: 497-10048 - BOARD EVAL ACCELEROMETER497-10030 - STARTER KIT FOR STM32KSDKSTM32-PL - KIT IAR KICKSTART STM32 CORTEXM3497-8512 - KIT STARTER FOR STM32F10XE MCU497-8511 - KIT STARTER FOR STM32 512K FLASH497-8505 - KIT STARTER FOR STM32F10XE MCU497-8418 - BOARD DEMO DGTL PHOTOFRAME STM32497-6438 - BOARD EVALUTION FOR STM32 512K497-6289 - KIT PERFORMANCE STICK FOR STM32MCBSTM32UME - BOARD EVAL MCBSTM32 + ULINK-MEMCBSTM32U - BOARD EVAL MCBSTM32 + ULINK2MCBSTM32 - BOARD EVAL FOR STM STM32X SER497-6053 - KIT STARTER FOR STM32497-6052 - KIT STARTER FOR STM32497-6050 - KIT STARTER FOR STM32497-6049 - KIT EVALUATION LOW COST STM32497-6048 - BOARD EVALUATION FOR STM32497-6047 - KIT DEVELOPMENT FOR STM32
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

Package characteristics
6.1
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Thermal characteristics
The average chip-junction temperature, T
following equation:
Where:
P
Most of the time for the application P
may be significant if the device is configured to drive continuously external modules and/or
memories.
An approximate relationship between P
Therefore (solving equations 1 and 2):
where:
K is a constant for the particular part, which may be determined from equation (3) by
measuring P
may be obtained by solving equations (1) and (2) iteratively for any value of T
Table 46.
Symbol
I/O
JA
represents the Power Dissipation on Input and Output Pins;
T
P
P
A
JA
D
INT
is the Ambient Temperature in C,
is the sum of P
is the Package Junction-to-Ambient Thermal Resistance, in C/W,
Thermal resistance junction-ambient
LFBGA100 - 10 x 10 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP100 - 14 x 14 mm / 0.5 mm pitch
Thermal Resistance Junction-Ambient
LQFP64 - 10 x 10 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP48 - 7 x 7 mm / 0.5 mm pitch
is the product of I
D
Thermal characteristics
(at equilibrium) for a known T
INT
K = P
and P
DD
P
T
D
J
D
and V
= K / (T
= T
x (T
Parameter
I/O
A
(P
A
DD
I/O
+ (P
+ 273°C) +
D
, expressed in Watts. This is the Chip Internal Power.
J
< P
D
= P
+ 273 °C)
D
J
and T
INT
, in degrees Celsius, may be calculated using the
x
INT
A.
and can be neglected. On the other hand, P
JA
Using this value of K, the values of P
+ P
J
)
(if P
I/O
JA
I/O
),
x P
is neglected) is given by:
D
2
(1)
(2)
(3)
Value
41
46
45
55
STM32F103xx
A
.
D
and T
°C/W
Unit
I/O
J