STM32F103RBT7TR STMicroelectronics, STM32F103RBT7TR Datasheet - Page 74

• Manufacturer Part Number: STM32F103RBT7TR
• Description: MCU ARM 32BIT 64KB FLASH 64LQFP
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F103RBT7TR

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
• Peripherals: DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
• Number Of I /o: 51
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 20K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 64-LQFP
• Processor Series: STM32F103x
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 20 KB
• Interface Type: CAN, I2C, SPI, USART, USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 51
• Number Of Timers: 4
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWARM, EWARM-BL, KSDK-STM32-PLUS, KSK-STM32-JL, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: ST-LINK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 2 (12 bit, 16 Channel)
• For Use With: 497-10048 - BOARD EVAL ACCELEROMETER497-10030 - STARTER KIT FOR STM32KSDKSTM32-PL - KIT IAR KICKSTART STM32 CORTEXM3497-8512 - KIT STARTER FOR STM32F10XE MCU497-8511 - KIT STARTER FOR STM32 512K FLASH497-8505 - KIT STARTER FOR STM32F10XE MCU497-8418 - BOARD DEMO DGTL PHOTOFRAME STM32497-6438 - BOARD EVALUTION FOR STM32 512K497-6289 - KIT PERFORMANCE STICK FOR STM32MCBSTM32UME - BOARD EVAL MCBSTM32 + ULINK-MEMCBSTM32U - BOARD EVAL MCBSTM32 + ULINK2MCBSTM32 - BOARD EVAL FOR STM STM32X SER497-6053 - KIT STARTER FOR STM32497-6052 - KIT STARTER FOR STM32497-6050 - KIT STARTER FOR STM32497-6049 - KIT EVALUATION LOW COST STM32497-6048 - BOARD EVALUATION FOR STM32497-6047 - KIT DEVELOPMENT FOR STM32
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

Package characteristics
1. Drawing is not to scale.
2. The back-side pad is not internally connected to the V
3. There is an exposed die pad on the underside of the VFQFPN package. It should be soldered to the PCB. All leads should
Table 50.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
74/92
A
A1
A2
A3
b
D
D2
E
E2
e
L
ddd
Figure 35. VFQFPN36 6 x 6 mm, 0.5 mm pitch,
Pin # 1 ID
R = 0.20
Seating plane
also be soldered to the PCB. It is recommended to connect it to V
Symbol
D
C
e
A3
28
36
VFQFPN36 6 x 6 mm, 0.5 mm pitch, package mechanical data
package outline
27
1
0.800
0.180
5.875
1.750
5.875
1.750
0.450
0.350
Min
b
E2
E
(1)
millimeters
9
0.900
0.020
0.650
0.250
0.230
6.000
3.700
6.000
3.700
0.500
0.550
0.080
19
Typ
18
10
A1
D2
Doc ID 13587 Rev 11
A2
L
A
SS
or V
1.000
0.050
1.000
0.300
6.125
4.250
6.125
4.250
0.550
0.750
Max
ddd C
DD
power pads.
ZR_ME
SS
.
Figure 36. Recommended footprint
4.30
0.0315
0.0071
0.2313
0.0689
0.2313
0.0689
0.0177
0.0138
Min
28
36
27
1
STM32F103x8, STM32F103xB
(dimensions in mm)
4.80
inches
0.0354
0.0008
0.0256
0.0098
0.0091
0.2362
0.1457
0.2362
0.1457
0.0197
0.0217
0.0031
4.10
4.80
Typ
4.30
6.30
(1)
4.10
0.30
19
9
1.00
0.0394
0.0020
0.0394
0.0118
0.2411
0.1673
0.2411
0.1673
0.0217
0.0295
(1)(2)(3)
18
10
Max
0.75
0.50
ai14870b