STM32F103ZDH6 STMicroelectronics, STM32F103ZDH6 Datasheet - Page 11

• Manufacturer Part Number: STM32F103ZDH6
• Description: MCU ARM 32BIT 384KB FLASH 144BGA
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F103ZDH6

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
• Peripherals: DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
• Number Of I /o: 112
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 21x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-BGA
• Processor Series: STM32F103x
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 64 KB
• Interface Type: CAN, I2C, SPI, USART
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 112
• Number Of Timers: 8
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 3 (12 bit, 16 Channel)
• On-chip Dac: 2 (12 bit, 2 Channel)
• Featured Product: STM32 Cortex-M3 Companion Products
• Eeprom Size: -
• For Use With: 497-10048 - BOARD EVAL ACCELEROMETER497-10030 - STARTER KIT FOR STM32KSDKSTM32-PL - KIT IAR KICKSTART STM32 CORTEXM3497-8512 - KIT STARTER FOR STM32F10XE MCU497-8511 - KIT STARTER FOR STM32 512K FLASH497-8505 - KIT STARTER FOR STM32F10XE MCU497-6438 - BOARD EVALUTION FOR STM32 512K497-6289 - KIT PERFORMANCE STICK FOR STM32MCBSTM32UME - BOARD EVAL MCBSTM32 + ULINK-MEMCBSTM32U - BOARD EVAL MCBSTM32 + ULINK2MCBSTM32 - BOARD EVAL FOR STM STM32X SER497-6053 - KIT STARTER FOR STM32497-6052 - KIT STARTER FOR STM32497-6050 - KIT STARTER FOR STM32497-6049 - KIT EVALUATION LOW COST STM32497-6048 - BOARD EVALUATION FOR STM32497-6047 - KIT DEVELOPMENT FOR STM32
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

STM32F103xC, STM32F103xD, STM32F103xE
2.1
Device overview
Table 2.
1. 64 KB RAM for 256 KB Flash are available on devices delivered in CSP packages only.
2. For the LQFP100 and BGA100 packages, only FSMC Bank1 and Bank2 are available. Bank1 can only
3. The SPI2 and SPI3 interfaces give the flexibility to work in an exclusive way in either the SPI mode or the
Flash memory in Kbytes
SRAM in Kbytes
FSMC
Timers
Comm
GPIOs
12-bit ADC
Number of channels
12-bit DAC
Number of channels
CPU frequency
Operating voltage
Operating temperatures
Package
support a multiplexed NOR/PSRAM memory using the NE1 Chip Select. Bank2 can only support a 16- or
8-bit NAND Flash memory using the NCE2 Chip Select. The interrupt line cannot be used since Port G is
not available in this package.
I
2
S audio mode.
Peripherals
General-purpose
Advanced-control
Basic
SPI(I
I
USART
USB
CAN
SDIO
2
C
STM32F103xC, STM32F103xD and STM32F103xE features and peripheral
counts
2
S)
(3)
LQFP64
Ambient temperatures: –40 to +85 °C /–40 to +105 °C (see
256
48
Doc ID 14611 Rev 7
STM32F103Rx
Junction temperature: –40 to + 125 °C (see
No
51
16
3
384
WLCSP64
64
(1)
512
LQFP100, BGA100
256
48
2.0 to 3.6 V
STM32F103Vx
72 MHz
3(2)
Yes
4
2
2
2
5
1
1
1
2
2
384
80
16
3
(2)
64
512
LQFP144, BGA144
256
48
Table
STM32F103Zx
Description
384
112
Yes
10)
21
3
Table
64
11/123
512
10)