STM32F103ZET7 STMicroelectronics, STM32F103ZET7 Datasheet - Page 122

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STM32F103ZET7

Manufacturer Part Number
STM32F103ZET7
Description
MCU ARM 32BIT 512K FLASH 144LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet

Specifications of STM32F103ZET7

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
Peripherals
DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
112
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 21x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 105°C
Package / Case
144-LQFP
Processor Series
STM32F103x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
64 KB
Interface Type
CAN, I2C, SPI, USART
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
112
Number Of Timers
8
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, KSDK-STM32-PLUS, KSK-STM32F103ZE, MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
3 (12 bit, 16 Channel)
On-chip Dac
2 (12 bit, 2 Channel)
Featured Product
STM32 Cortex-M3 Companion Products
Eeprom Size
-
A/d Bit Size
12 bit
A/d Channels Available
16
Height
1.4 mm
Length
20 mm
Supply Voltage (max)
3.6 V
Supply Voltage (min)
2 V
Width
20 mm
For Use With
497-10048 - BOARD EVAL ACCELEROMETER497-10030 - STARTER KIT FOR STM32497-9048 - BOARD DEMO BASED ON STM32F103ZEKSDKSTM32-PL - KIT IAR KICKSTART STM32 CORTEXM3497-8512 - KIT STARTER FOR STM32F10XE MCU497-8511 - KIT STARTER FOR STM32 512K FLASH497-8505 - KIT STARTER FOR STM32F10XE MCU497-6438 - BOARD EVALUTION FOR STM32 512K497-6289 - KIT PERFORMANCE STICK FOR STM32MCBSTM32UME - BOARD EVAL MCBSTM32 + ULINK-MEMCBSTM32U - BOARD EVAL MCBSTM32 + ULINK2MCBSTM32 - BOARD EVAL FOR STM STM32X SER497-6053 - KIT STARTER FOR STM32497-6052 - KIT STARTER FOR STM32497-6050 - KIT STARTER FOR STM32497-6049 - KIT EVALUATION LOW COST STM32497-6048 - BOARD EVALUATION FOR STM32497-6047 - KIT DEVELOPMENT FOR STM32
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
STM32F103ZET7
Manufacturer:
STMicroelectronics
Quantity:
10 000
Part Number:
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Revision history
122/123
Table 72.
24-Sep-2009
21-Jul-2009
Date
Document revision history
Revision
6
7
Figure 1: STM32F103xC, STM32F103xD and STM32F103xE
performance line block diagram
Note 5
STM32F103xx pin
V
voltage.
Table 16: Maximum current consumption in Sleep mode, code running
from Flash or RAM
f
characteristics.
C
characteristics
32.768
Note 1
crystal.
removed from
Jitter added to
Figure 43: Recommended NRST pin protection
In
timings: t
In
timings: t
In
t
In
t
In
t
In
cycles: t
Table 52: SPI characteristics
characteristics
C
R
Table 62: DAC characteristics
buffered DAC
Figure 60: LFBGA100 - 10 x 10 mm low profile fine pitch ball grid array
package outline
pitch ball grid array package mechanical data
Number of DACs corrected in
I
consumptions in Stop and Standby
Figure 16: Typical current consumption on VBAT with RTC on vs.
temperature at different VBAT values
IEC 1000 standard updated to IEC 61000 and SAE J1752/3 updated to
IEC 61967-2 in
Table 62: DAC characteristics
HSE_ext
h(AD_NADV)
h(A_NWE)
h(CLKH-NWAITV)
DD_VBAT
RERINT
L1
ADC
AIN
Table 31: Asynchronous non-multiplexed SRAM/PSRAM/NOR read
Table 32: Asynchronous non-multiplexed SRAM/PSRAM/NOR write
Table 33: Asynchronous multiplexed PSRAM/NOR read
Table 34: Asynchronous multiplexed PSRAM/NOR write
Table 35: Synchronous multiplexed NOR/PSRAM read
Table 40: Switching characteristics for NAND Flash read and write
and C
Doc ID 14611 Rev 7
max values modified in
and R
updated and
modified below
kHz), notes modified and moved below the tables.
Table 25: HSI oscillator characteristics
h(NOE-D)
min modified in
and T
h(BL_NOE)
h(A_NWE)
updated in
modified.
L2
and t
AIN
replaced by C in
added.
Table 27: Low-power mode wakeup
Coeff
Table 28: PLL
and
and
Section 5.3.11: EMC characteristics on page
modified.
parameters modified in
and
h(A_NOE)
modified.
STM32F103xC, STM32F103xD, STM32F103xE
and t
definitions.
and t
Table 24: LSE oscillator characteristics (fLSE =
Table 54: SD / MMC
added to
modified.
Note 4
Table 17: Typical and maximum current
Table 65: LFBGA100 - 10 x 10 mm low profile fine
Figure 22: Typical application with an 8 MHz
h(Data_NWE)
h(A_NOE)
Table 21: High-speed external user clock
modified.
added in
Table 59: RAIN max for fADC = 14
Table 13: Embedded internal reference
modified. Values added to
characteristics.
Table 23: HSE 4-16 MHz oscillator
Table 3: STM32F103xx
modified.
modified. Small text changes.
Changes
updated.
modified.
modified.
modes.
Table 5: High-density
added.
Table 58: ADC
Figure 57: 12-bit buffered /non-
characteristics.
updated.
modified. Conditions
modified.
timings.
family.
characteristics.
Table 53: I2S
timings:
timings:
timings:
80.
MHz.

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