MC908QY4ACDWE Freescale Semiconductor, MC908QY4ACDWE Datasheet - Page 163

IC MCU 8BIT 4K FLASH 16-SOIC

MC908QY4ACDWE

Manufacturer Part Number
MC908QY4ACDWE
Description
IC MCU 8BIT 4K FLASH 16-SOIC
Manufacturer
Freescale Semiconductor
Series
HC08r
Datasheet

Specifications of MC908QY4ACDWE

Core Processor
HC08
Core Size
8-Bit
Speed
8MHz
Peripherals
LVD, POR, PWM
Number Of I /o
13
Program Memory Size
4KB (4K x 8)
Program Memory Type
FLASH
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
16-SOIC (0.300", 7.5mm Width)
Processor Series
HC08QY
Core
HC08
Data Bus Width
8 bit
Data Ram Size
128 B
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
13
Number Of Timers
2
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Development Tools By Supplier
FSICEBASE, M68CBL05AE, DEMO908QB8, DEMO908QC16
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 6 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Connectivity
-
Lead Free Status / Rohs Status
 Details

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16.11 Oscillator Characteristics
Freescale Semiconductor
Internal oscillator frequency
Trim accuracy
Deviation from trimmed Internal oscillator
External RC oscillator frequency, RCCLK
External clock reference frequencyy
RC oscillator external resistor
Crystal frequency, XTALCLK
ECFS1:ECFS0 = 00
ECFS1:ECFS0 = 01
AWU module internal RC oscillator frequency
1. Bus frequency, f
2. Factory trimmed to provided 12.8MHz accuracy requirement (± 5%, @25•C) for forced monitor mode communication. User
3. Values are based on characterization results, not tested in production.
4. Deviation values assumes trimming in target application @25•C and midpoint of voltage range, for example 5.0 V for 5 V
5. No more than 10% duty cycle deviation from 50%.
6. When external oscillator clock is greater than 1MHz, ECFS1:ECFS0 must be 00 or 01
7. Use fundamental mode only, do not use overtone crystals or overtone ceramic resonators
8. Due to variations in electrical properties of external components such as, ESR and Load Capacitance, operation above
9. Do not use damping resistor when ECFS1:ECFS0 = 00 or 10
10. Consult crystal vendor data sheet.
ICFS1:ICFS0 = 00
ICFS1:ICFS0 = 01
ICFS1:ICFS0 = 10 (not allowed if V
4, 8, 12.8MHz, V
4, 8, 12.8MHz, V
V
V
V
V
ECFS1:ECFS0 = 00 ( V
ECFS1:ECFS0 = 00
ECFS1:ECFS0 = 01
ECFS1:ECFS0 = 10
Feedback bias resistor
Crystal load capacitance
Crystal capacitors
Crystal series damping resistor
Feedback bias resistor
Crystal load capacitance
Crystal capacitors
DD
DD
DD
DD
f
f
f
should trim in-circuit to obtain the most accurate internal oscillator frequency for the application.
± 10% operation.
16 MHz is not guaranteed for all crystals or ceramic resonators. Operation above 16 MHz requires that a Negative Resis-
tance Margin (NRM) characterization and component optimization be performed by the crystal or ceramic resonator vendor
for every different type of crystal or ceramic resonator which will be used. This characterization and optimization must be
performed at the extremes of voltage and temperature which will be applied to the microcontroller in the application. The
NRM must meet or exceed 10x the maximum ESR of the crystal or ceramic resonator for acceptable performance.
OSCXCLK
OSCXCLK
OSCXCLK
≥ 4.5V
< 4.5V
= 5 V
= 3 V
= 1 MHz
= 4 MHz
= 8 MHz
(2)(3)
DD
DD
Characteristic
(10)
(10)
OP
(9)
(9)
± 10%, 0 to 70°C
± 10%, –40 to 125°C
, is oscillator frequency divided by 4.
DD
(10)
(10)
(1)
(1)(7)(8)
≥ 4.5 V)
(3)
(1)(5)(6)
DD
MC68HC908QYA/QTA Family Data Sheet, Rev. 3
<2.7V)
(3)(4)
(1)(3)
Δ
Δ
f
f
Symbol
OSCXCLK
OSCXCLK
TRIM_ACC
f
INT_TRIM
f
f
INTCLK
C
C
RCCLK
R
INTRC
R
R
R
C
1
C
1
EXT
,C
,C
B
S
B
L
L
2
2
Min
30
dc
dc
2
8
8
1
See
See
(2 x C
(2 x C
Figure 16-7
Figure 16-8
± 0.4
12.8
Typ
L
± 2
20
20
10
18
32
L
4
8
1
0
5
) –10 pF
) – 5pF
Oscillator Characteristics
Max
100
± 5
10
32
16
32
16
8
MHz
MHz
MHz
MHz
MHz
MHz
Unit
kHz
kHz
pF
pF
pF
pF
%
%
163

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