MC9S08QE8CLC Freescale Semiconductor, MC9S08QE8CLC Datasheet - Page 20

• Manufacturer Part Number: MC9S08QE8CLC
• Description: IC MCU 8BIT 8K FLASH 32-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08QE8CLC

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, LIN, SCI, SPI
• Peripherals: LVD, PWM, WDT
• Number Of I /o: 26
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 32-LQFP
• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 20MHz
• Interface Type: I2C/SCI/SPI
• Total Internal Ram Size: 512Byte
• # I/os (max): 26
• Number Of Timers - General Purpose: 2
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 1.8V
• On-chip Adc: 10-chx12-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 32
• Package Type: LQFP
• Processor Series: S08QE
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 512 B
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 26
• Number Of Timers: 2
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMOQE128, EVBQE128
• Minimum Operating Temperature: - 40 C
• Package: 32LQFP
• Family Name: HCS08
• Maximum Speed: 20 MHz
• Operating Supply Voltage: 2.5|3.3 V
• For Use With: DEMO9S08QE8 - BOARD DEMO FOR MC9S08Q
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

Electrical Characteristics
3.10
This section describes timing characteristics for each peripheral system.
3.10.1
20
1
2
3
4
5
Num
Typical values are based on characterization data at V
This is the shortest pulse that is guaranteed to be recognized as a reset pin request.
To enter BDM mode following a POR, BKGD/MS should be held low during the power-up and for a hold time of t
rises above V
This is the minimum pulse width that is guaranteed to pass through the pin synchronization circuitry. Shorter pulses may or
may not be recognized. In stop mode, the synchronizer is bypassed so shorter pulses can be recognized.
Timing is shown with respect to 20% V
10
1
2
3
4
5
6
8
7
9
C
D
D
D
D
D
D
D
C
D
C
AC Characteristics
Control Timing
Bus frequency (t
Internal low power oscillator period
External reset pulse width
Reset low drive
BKGD/MS setup time after issuing background debug
force reset to enter user or BDM modes
BKGD/MS hold time after issuing background debug
force reset to enter user or BDM modes
IRQ pulse width
Keyboard interrupt pulse width
Port rise and fall time —
Low output drive (PTxDS = 0) (load = 50 pF)
Port rise and fall time —
High output drive (PTxDS = 1) (load = 50 pF)
Voltage regulator recovery time
Asynchronous path
Synchronous path
Asynchronous path
Synchronous path
LVD
Slew rate control disabled (PTxSE = 0)
Slew rate control enabled (PTxSE = 1)
Slew rate control enabled (PTxSE = 1)
Slew rate control disabled (PTxSE = 0)
.
RESET PIN
cyc
= 1/f
4
4
2
2
Rating
Bus
2
DD
)
MC9S08QE8 Series Data Sheet, Rev. 8
and 80% V
Table 12. Control Timing
Figure 15. Reset Timing
3
DD
DD
5
levels. Temperature range –40C to 85C.
5
= 3.0 V, 25 C unless otherwise stated.
t
extrst
t
t
t
t
Symbol
ILIH,
ILIH,
Rise
Rise
t
t
t
MSSU
t
t
t
rstdrv
f
extrst
MSH
VRR
LPO
Bus
, t
, t
t
t
IHIL
IHIL
Fall
Fall
1.5  t
1.5  t
34  t
Min
700
100
500
100
100
100
dc
—
—
—
—
—
cyc
cyc
cyc
Typical
16
23
—
—
—
—
—
—
—
—
—
—
5
9
4
Freescale Semiconductor
1
1300
Max
10
—
—
—
—
—
—
—
—
—
—
—
—
—
MSH
after V
Unit
MHz
s
ns
ns
ns
s
ns
ns
ns
ns
s
DD