MC9S08QE8CLC Freescale Semiconductor, MC9S08QE8CLC Datasheet - Page 29

IC MCU 8BIT 8K FLASH 32-LQFP

MC9S08QE8CLC

Manufacturer Part Number
MC9S08QE8CLC
Description
IC MCU 8BIT 8K FLASH 32-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheets

Specifications of MC9S08QE8CLC

Core Processor
HCS08
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, LIN, SCI, SPI
Peripherals
LVD, PWM, WDT
Number Of I /o
26
Program Memory Size
8KB (8K x 8)
Program Memory Type
FLASH
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 10x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
32-LQFP
Cpu Family
HCS08
Device Core Size
8b
Frequency (max)
20MHz
Interface Type
I2C/SCI/SPI
Total Internal Ram Size
512Byte
# I/os (max)
26
Number Of Timers - General Purpose
2
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
1.8V
On-chip Adc
10-chx12-bit
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
32
Package Type
LQFP
Processor Series
S08QE
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
512 B
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
26
Number Of Timers
2
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMOQE128, EVBQE128
Minimum Operating Temperature
- 40 C
Package
32LQFP
Family Name
HCS08
Maximum Speed
20 MHz
Operating Supply Voltage
2.5|3.3 V
For Use With
DEMO9S08QE8 - BOARD DEMO FOR MC9S08Q
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Compliant

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3.13
This section provides details about program/erase times and program-erase endurance for the flash
memory.
Program and erase operations do not require any special power sources other than the normal V
For more detailed information about program/erase operations, see the Memory section.
3.14
Electromagnetic compatibility (EMC) performance is highly dependant on the environment in which the
MCU resides. Board design and layout, circuit topology choices, location and characteristics of external
components as well as MCU software operation all play a significant role in EMC performance. The
system designer should consult Freescale applications notes such as AN2321, AN1050, AN1263,
AN2764, and AN1259 for advice and guidance specifically targeted at optimizing EMC performance.
Freescale Semiconductor
1
2
3
4
5
These values are hardware state machine controlled. User code does not need to count cycles. This information supplied
for calculating approximate time to program and erase.
The program and erase currents are additional to the standard run I
with V
Typical endurance for flash was evaluated for this product family on the 9S12Dx64. For additional information on how
Freescale defines typical endurance, please refer to Engineering Bulletin EB619, Typical Endurance for Nonvolatile
Memory.
Typical data retention values are based on intrinsic capability of the technology measured at high temperature and
de-rated to 25C using the Arrhenius equation. For additional information on how Freescale defines typical data retention,
please refer to Engineering Bulletin EB618, Typical Data Retention for Nonvolatile Memory.
The frequency of this clock is controlled by a software setting.
C
D
D
D
D
P
P
P
P
C
C
DD
Flash Specifications
EMC Performance
Supply voltage for program/erase
–40 C to 85 C
Supply voltage for read operation
Internal FCLK frequency
Internal FCLK period (1/FCLK)
Byte program time (random location)
Byte program time (burst mode)
Page erase time
Mass erase time
Byte program current
Page erase current
Program/erase endurance
Data retention
= 3.0 V, bus frequency = 4.0 MHz.
T
T = 25 C
L
to T
H
= –40C to 85 C
Characteristic
5
2
2
3
3
1
4
MC9S08QE8 Series Data Sheet, Rev. 8
2
Table 18. Flash Characteristics
2
V
Symbol
RI
RI
prog/erase
V
f
t
t
t
t
t
t
FCLK
D_ret
Burst
Page
Mass
Fcyc
Read
prog
DDBP
DDPE
DD
10,000
. These values are measured at room temperatures
Min
150
1.8
1.8
15
5
100,000
Typical
20,000
4000
100
9
4
4
6
Electrical Characteristics
Max
6.67
200
3.6
3.6
DD
cycles
years
t
t
t
t
Unit
kHz
mA
mA
Fcyc
Fcyc
Fcyc
Fcyc
s
V
V
supply.
29

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