MC9S08QE8CLC Freescale Semiconductor, MC9S08QE8CLC Datasheet - Page 31

• Manufacturer Part Number: MC9S08QE8CLC
• Description: IC MCU 8BIT 8K FLASH 32-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08QE8CLC

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, LIN, SCI, SPI
• Peripherals: LVD, PWM, WDT
• Number Of I /o: 26
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 32-LQFP
• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 20MHz
• Interface Type: I2C/SCI/SPI
• Total Internal Ram Size: 512Byte
• # I/os (max): 26
• Number Of Timers - General Purpose: 2
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 1.8V
• On-chip Adc: 10-chx12-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 32
• Package Type: LQFP
• Processor Series: S08QE
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 512 B
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 26
• Number Of Timers: 2
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMOQE128, EVBQE128
• Minimum Operating Temperature: - 40 C
• Package: 32LQFP
• Family Name: HCS08
• Maximum Speed: 20 MHz
• Operating Supply Voltage: 2.5|3.3 V
• For Use With: DEMO9S08QE8 - BOARD DEMO FOR MC9S08Q
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

5
5.1
The following pages are mechanical drawings for the packages described in
Freescale Semiconductor
Pin Count
32
32
28
20
16
16
Package Information
Mechanical Drawings
(MC = Fully qualified)
Quad Flat No-Leads
Low Quad Flat Package
Small Outline Integrated Circuit
Small Outline Integrated Circuit
Plastic Dual In-line Package
Thin Shrink Small Outline Package
(9 = Flash-based)
Package Type
Memory
Status
Family
Core
MC
MC9S08QE8 Series Data Sheet, Rev. 8
Table 21. Package Descriptions
9 S08
QE 8
Abbreviation
TSSOP
LQFP
SOIC
SOIC
PDIP
QFN
C
XX
Designator
(C = –40 C to 85 C)
Temperature range
Package designator (see
Approximate flash size in Kbytes
FM
WL
WJ
PG
TG
LC
Table
Case No.
873A
751D
2078
751F
948F
648
21.
Table
Package Information
21)
Document No.
98ASA00071D
98ASH70029A
98ASH70247A
98ASB42345B
98ASB42343B
98ASB42431B
31