S9S08DZ32F1MLH Freescale Semiconductor, S9S08DZ32F1MLH Datasheet - Page 25
S9S08DZ32F1MLH
Manufacturer Part Number
S9S08DZ32F1MLH
Description
MCU 32K FLASH MASK AUTO 64-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet
1.DEMO9S08DZ60.pdf
(416 pages)
Specifications of S9S08DZ32F1MLH
Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
CAN, I²C, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
53
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 24x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
64-LQFP
Processor Series
S08D
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
2 KB
Interface Type
SCI, SPI
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
53
Number Of Timers
8
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08DZ60
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 24 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
S9S08DZ32F1MLH
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
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EXTAL
Freescale Semiconductor
* The fixed frequency clock (FFCLK) is internally
synchronized to the bus clock and must not exceed one half
of the bus clock frequency.
XOSC
MCG
1 kHZ
LPO
XTAL
MCGFFCLKVALID
MCGERCLK
MCGIRCLK
MCGFFCLK
MCGOUT
MCGLCLK
CPU
Figure 1-2. MC9S08DZ60 System Clock Distribution Diagram
÷
÷
2
2
BUSCLK
RTC
MC9S08DZ60 Series Data Sheet, Rev. 4
1
0
COP
BDC
TPM1CLK
TPM1
FFCLK*
TPM2CLK
TPM2
IIC
ADC has min and
max frequency
requirements.See
the ADC chapter and
electricals appendix
for details.
ADC
SCI1
MSCAN
Chapter 1 Device Overview
SCI2
Flash and
EEPROM have
frequency
requirements for
program and
erase operation.
See the
electricals
appendix for
details.
FLASH
SPI
EEPROM
25
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