MC908LJ24CPBER Freescale Semiconductor, MC908LJ24CPBER Datasheet - Page 452

• Manufacturer Part Number: MC908LJ24CPBER
• Description: IC MCU 24K FLASH 4/8MHZ 64-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HC08r

Specifications of MC908LJ24CPBER

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: I²C, IRSCI, SPI
• Peripherals: LCD, LVD, POR, PWM
• Number Of I /o: 40
• Program Memory Size: 24KB (24K x 8)
• Program Memory Type: FLASH
• Ram Size: 768 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-LQFP
• Controller Family/series: HC08
• No. Of I/o's: 40
• Ram Memory Size: 768Byte
• Cpu Speed: 8MHz
• No. Of Timers: 2
• Embedded Interface Type: I2C, SCI, SPI
• Rohs Compliant: Yes
• Processor Series: HC08LJ
• Core: HC08
• Data Bus Width: 8 bit
• Data Ram Size: 768 B
• Interface Type: SCI, SPI
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 48
• Number Of Timers: 4
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: FSICEBASE, M68EML08LJLKE, ZK-HC08LX-A, M68CBL05CE
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 6 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

Mechanical Specifications
25.3 64-Pin Low-Profile Quad Flat Pack (LQFP)
Data Sheet
452
C L
VIEW Y
H
C
3X
SEATING
PLANE
AB
AB
A
A
Figure 25-1. 64-Pin Low-Profile Quad Flat Pack (Case No. 840F)
16
1
4X
VIEW Y
64
17
0.2 H A–B D
D/2
D1/2
X=A, B OR D
X
D1
D
60X
e/2
e
4X
4X
D
( 2)
( 3)
49
32
PLATING
Mechanical Specifications
48
33
4X 16 TIPS
B
E1/2
c
0.2 C A–B D
VIEW AA
ROTATED 90 CLOCKWISE
SECTION AB–AB
E/2
0.08
0.08 C
E1
BASE METAL
M
b1
b
E
C
A–B
D
c1
A1
NOTES:
MC68HC908LJ24/LK24 — Rev. 2.1
A2
1. ALL DIMENSIONING AND TOLERANCING PER
2.
3.
4. DATUMS A, B AND D TO BE DETERMINED AT
5. DIMENSIONS D AND E TO BE DETERMINED AT
6. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD
7. DIMENSION b DOES NOT INCLUDE DAMBAR
VIEW AA
ANSI Y14.5M, 1982.
CONTROLLING DIMENSION: MILLIMETER.
DATUM PLANE H IS COINCIDENT WITH THE
BOTTOM OF THE LEAD WHERE THE LEAD EXITS
THE PLASTIC BODY AT THE BOTTOM OF THE
PARTING LINE.
DATUM PLANE H.
SEATING PLANE C.
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
PER SIDE. DIMENSIONS D1 AND E1 DO INCLUDE
MOLD MISMATCH AND ARE DETERMINED AT
DATUM PLANE H.
PROTRUSION. THE DAMBAR PROTRUSION
SHALL NOT CAUSE THE b DIMENSION TO
EXCEED 0.35. MINIMUM SPACE BETWEEN
PROTRUSION AND ADJACENT LEAD OR
PROTRUSION 0.07.
(S)
0.05
DIM
(L2)
A1
A2
D1
R1
b1
c1
E1
L1
L2
A
b
c
D
e
E
L
S
1
2
3
MILLIMETERS
S
MIN
0.05
1.35
0.17
0.17
0.09
0.09
0.45
0.10
—
0
0
12.00 BSC
10.00 BSC
12.00 BSC
10.00 BSC
1.00 REF
0.50 REF
12 REF
12 REF
0.20 REF
0.50 BSC
Freescale Semiconductor
(L)
1.60
0.15
1.45
0.27
0.23
0.20
0.16
0.75
0.20
MAX
L
—
7
1
GAGE PLANE
2X R
0.25
R1