MC68HC11D0CFNE2 Freescale Semiconductor, MC68HC11D0CFNE2 Datasheet - Page 122
MC68HC11D0CFNE2
Manufacturer Part Number
MC68HC11D0CFNE2
Description
MCU 8-BIT 192 RAM 2MHZ 44-PLCC
Manufacturer
Freescale Semiconductor
Series
HC11r
Specifications of MC68HC11D0CFNE2
Core Processor
HC11
Core Size
8-Bit
Speed
2MHz
Connectivity
SCI, SPI
Peripherals
POR, WDT
Number Of I /o
26
Program Memory Type
ROMless
Ram Size
192 x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
44-PLCC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC68HC11D0CFNE2
Manufacturer:
TI
Quantity:
7 482
Company:
Part Number:
MC68HC11D0CFNE2
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Company:
Part Number:
MC68HC11D0CFNE2R
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Ordering Information and Mechanical Specifications
10.4 44-Pin PLCC (Case 777-02)
122
-L-
C
0.010 (0.25)
Z
44
G
G1
S
A
R
T
1
L-M
-N-
V
NOTES:
1. DATUMS -L-, -M-, AND -N- ARE DETERMINED
2. DIMENSION G1, TRUE POSITION TO BE
3. DIMENSION R AND U DO NOT INCLUDE MOLD
4. DIMENSIONING AND TOLERANCING PER ANSI
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
7. DIMINSION H DOES NOT INCLUDE DAMBAR
S
WHERE TOP OF LEAD SHOLDERS EXITS
PLASTIC BODY AT MOLD PARTING LINE.
MEASURED AT DATUM -T-, SEATING PLANE.
FLASH. ALLOWABLE MOLD FLASH IS 0.010
(0.25) PER SIDE.
Y14.5M, 1982.
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE DETERMINED
AT THE OUTERMOST EXTREMES OF THE
PLASTIC BODY EXCLUSIVE OF THE MOLD
FLASH, TIE BAR BURRS, GATE BURRS AND
INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM
OF THE PLASTIC BODY.
PROTRUSION OR INTRUSION. THE DAMBAR
PROTUSION(S) SHALL NOT CAUSE THE H
DIMINSION TO BE GREATER THAN 0.037
(0.940124). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMINISION TO SMALLER
THAN 0.025 (0.635).
N S
E
Y
BRK
-M-
0.007(0.180)
0.007(0.180)
W
MC68HC711D3 Data Sheet, Rev. 2.1
J
VIEW S
D
D
-T-
M
M
T
T
0.004 (0.10)
SEATING
PLANE
L-M
L-M
S
S
DIM
G1
K1
W
A
B
C
E
G
H
K
R
U
V
X
Y
F
J
Z
N S
N S
0.042
MIN
0.685
0.685
0.165
0.090
0.013
0.026
0.020
0.025
0.650
0.650
0.042
0.042
0.610
0.040
2°
0.050 BSC
INCHES
B
X
Z
K
VIEW D-D
MAX
0.695
0.695
0.180
0.110
0.019
0.032
0.656
0.656
0.048
0.048
0.056
0.020
0.630
10°
U
VIEW S
0.007(0.180)
H
17.40
17.40
16.51
16.51
15.50
MIN
MILLIMETERS
4.20
2.29
0.33
0.66
0.51
0.64
1.07
1.07
1.07
1.02
2°
1.27 BSC
0.007(0.180)
0.007(0.180)
MAX
F
17.65
17.65
16.66
16.66
16.00
10°
4.57
2.79
0.48
0.81
1.21
1.21
1.42
0.50
K1
M
0.007(0.180)
G1
0.010 (0.25)
T
M
M
L-M
Freescale Semiconductor
T
T
S
M
L-M
L-M
S
N S
T
T
S
S
L-M
L-M
N S
N S
S
S
N S
N S