HD64F3672FPIV Renesas Electronics America, HD64F3672FPIV Datasheet - Page 317
HD64F3672FPIV
Manufacturer Part Number
HD64F3672FPIV
Description
MCU 3/5V 16K I-TEMP PB-FREE 64-L
Manufacturer
Renesas Electronics America
Series
H8® H8/300H Tinyr
Datasheet
1.HD64F3672FXV.pdf
(334 pages)
Specifications of HD64F3672FPIV
Core Processor
H8/300H
Core Size
16-Bit
Speed
16MHz
Connectivity
SCI
Peripherals
PWM, WDT
Number Of I /o
26
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
For Use With
R0K436079S000BE - KIT DEV FOR H8/36079 W/COMPILER
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
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B.2
Note:
Port
P17 to P14,
P12 to P10
P22 to P20
P57 to P50
P76 to P74
P84 to P80
PB3 to PB0
*
Port States in Each Operating State
High level output when the pull-up MOS is in on state.
Reset
High impedance
High impedance
High impedance
High impedance
High impedance
High impedance
Active
Functioning
Functioning
Functioning
Functioning
Functioning
High
impedance
Sleep
Retained
Retained
Retained
Retained
Retained
High
impedance
Rev.4.00 Nov. 02, 2005 Page 291 of 304
Subsleep
Retained
Retained
Retained
Retained
Retained
Retained
High impedance*
High impedance
High impedance*
High impedance
High impedance
Standby
High impedance
REJ09B0143-0400
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