DF2210CUNP24V Renesas Electronics America, DF2210CUNP24V Datasheet - Page 210
DF2210CUNP24V
Manufacturer Part Number
DF2210CUNP24V
Description
MCU 16BIT FLASH 3V 32K 64-QFN
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheet
1.DF2218UTF24V.pdf
(758 pages)
Specifications of DF2210CUNP24V
Core Processor
H8S/2000
Core Size
16-Bit
Speed
24MHz
Connectivity
SCI, SmartCard, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
37
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 6x10b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
64-QFN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
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Manufacturer
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Part Number:
DF2210CUNP24V
Manufacturer:
Renesas Electronics America
Quantity:
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Figure 6.25 shows the timing for transition to the bus-released state.
6.9.1
When MSTPCR is set to H'FFFFFF and transmitted to sleep mode, the external bus release does
not function. To activate the external bus release in sleep mode, do not set MSTPCR to H'FFFFFF.
Rev.7.00 Dec. 24, 2008 Page 154 of 698
REJ09B0074-0700
Address bus
HWR, LWR
Data bus
Bus Release Usage Note
Note : n = 0 to 5
[1]
[2]
[3]
[4]
[5]
BREQ
BACK
CSn
RD
AS
φ
Low level of BREQ pin is sampled at rise of T
BACK pin is driven low at end of CPU read cycle, releasing bus to external bus
master.
BREQ pin state is still sampled in external bus released state.
High level of BREQ pin is sampled.
BACK pin is driven high, ending bus release cycle.
Figure 6.25 Bus-Released State Transition Timing
T
0
CPU cycle
T
Address
1
[1]
Minimum
1 state
T
2
[2]
2
[3]
state.
External bus released state
High impedance
High impedance
High impedance
High impedance
High impedance
High impedance
[4]
CPU
cycle
[5]
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