MC9S12XEQ512CAL Freescale Semiconductor, MC9S12XEQ512CAL Datasheet - Page 1260

• Manufacturer Part Number: MC9S12XEQ512CAL
• Description: MCU 16BIT 512K FLASH 112-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XEQ512CAL

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 91
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 112-LQFP
• No. Of I/o's: 91
• Eeprom Memory Size: 4KB
• Ram Memory Size: 32KB
• Cpu Speed: 50MHz
• No. Of Timers: 3
• No. Of Pwm Channels: 8
• Digital Ic Case Style: LQFP
• Rohs Compliant: Yes
• Processor Series: S12XE
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 32 KB
• Interface Type: CAN, SCI, SPI
• Maximum Clock Frequency: 50 MHz
• Number Of Programmable I/os: 91
• Number Of Timers: 25
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: KIT33812ECUEVME, EVB9S12XEP100, DEMO9S12XEP100
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 16 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Appendix B Package Information
B.1
B.2
1260
208 MAPBGA
144-Pin LQFP
0.3
0.1
Figure B-1. 208MAPBGA Mechanical Dimensions
208X
M
M
3
X
Z
MC9S12XE-Family Reference Manual , Rev. 1.23
Y
b
15X e
Z
S
E
X
16
15
14
0.2
13
12
VIEW M M
11
LASER MARK FOR PIN A1
IDENTIFICATION IN THIS AREA
4X
10
9
D
8
7
6
S
15X e
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
CASE 1159A-01
X
METALIZED MARK FOR PIN A1
IDENTIFICATION IN THIS AREA
ISSUE B
M
M
A
K
A1
A2
NOTES:
(ROTATED 90° CLOCKWISE)
1.
2.
3.
4.
5.
Z
DIM
A1
A2
A
D
E
S
ALL DIMENSIONS ARE IN MILLIMETERS.
INTERPRET DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER, PARALLEL TO DATUM
PLANE Z.
DATUM Z (SEATING PLANE) IS DEFINED BY THE
SPHERICAL CROWNS OF THE SOLDER BALLS.
PARALLELISM MEASEMENT SHALL EXCLUDE ANY
EFFECT OF MARK ON TOP SURFACE OF PACKAGE.
b
e
4
MILLIMETERS
MIN
0.40
1.00
0.50
VIEW K
---
17.00 BSC
17.00 BSC
1.00 BSC
0.50 BSC
MAX
2.00
0.60
1.30
0.70
DATE 12/12/98
0.2 Z
5
0.2
Z
208X
Freescale Semiconductor