MC9S12XEQ512CAL Freescale Semiconductor, MC9S12XEQ512CAL Datasheet - Page 1262

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MC9S12XEQ512CAL

Manufacturer Part Number
MC9S12XEQ512CAL
Description
MCU 16BIT 512K FLASH 112-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet

Specifications of MC9S12XEQ512CAL

Core Processor
HCS12X
Core Size
16-Bit
Speed
50MHz
Connectivity
CAN, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
91
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
1.72 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
112-LQFP
No. Of I/o's
91
Eeprom Memory Size
4KB
Ram Memory Size
32KB
Cpu Speed
50MHz
No. Of Timers
3
No. Of Pwm Channels
8
Digital Ic Case Style
LQFP
Rohs Compliant
Yes
Processor Series
S12XE
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
32 KB
Interface Type
CAN, SCI, SPI
Maximum Clock Frequency
50 MHz
Number Of Programmable I/os
91
Number Of Timers
25
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
KIT33812ECUEVME, EVB9S12XEP100, DEMO9S12XEP100
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 16 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Appendix B Package Information
B.3
1262
PIN 1
IDENT
C
L
C1
112-Pin LQFP Package
28
1
4X
C2
112
29
VIEW Y
0.050
VIEW AB
0.20
S1
A1
Figure B-3. 112-Pin LQFP Mechanical Dimensions (Case No. 987)
T
L-M
N
θ
A
S
MC9S12XE-Family Reference Manual , Rev. 1.23
N
(Y)
(Z)
(K)
E
R
θ
θ
4X 28 TIPS
2
3
R2
R
R1
85
56
θ
1
84
57
M
0.20
B1
GAGE PLANE
0.25
VIEW AB
T
T
V1
L-M
0.10
B
SEATING
PLANE
N
T
V
112X
C L
ROTATED 90 COUNTERCLOCKWISE
J1
J1
NOTES:
J
1. DIMENSIONING AND TOLERANCING PER
2. DIMENSIONS IN MILLIMETERS.
3. DATUMS L, M AND N TO BE DETERMINED AT
4. DIMENSIONS S AND V TO BE DETERMINED AT
5. DIMENSIONS A AND B DO NOT INCLUDE
6. DIMENSION D DOES NOT INCLUDE DAMBAR
ASME Y14.5M, 1994.
SEATING PLANE, DATUM T.
SEATING PLANE, DATUM T.
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.25 PER SIDE. DIMENSIONS
A AND B INCLUDE MOLD MISMATCH.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL NOT CAUSE THE D
DIMENSION TO EXCEED 0.46.
SECTION J1-J1
0.13
DIM
A1
B1
C1
C2
R1
R2
AA
θ
θ
θ
S1
V1
A
B
C
D
E
F
G
J
K
P
S
V
Y
Z
θ
1
2
3
108X
°
VIEW Y
0.050
1.350
0.270
0.450
0.270
0.090
0.100
0.100
0.090
MILLIMETERS
M
MIN
11
11
20.000 BSC
10.000 BSC
20.000 BSC
10.000 BSC
22.000 BSC
11.000 BSC
22.000 BSC
11.000 BSC
0.650 BSC
0.500 REF
0.325 BSC
0.250 REF
1.000 REF
---
0
0
D
F
°
°
°
°
G
T
1.600
0.150
1.450
0.370
0.750
0.330
0.170
0.200
0.200
0.160
4X
MAX
13
Freescale Semiconductor
L-M
13
8
7
°
°
°
°
P
X=L, M OR N
X
N
AA
BASE
METAL

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