MC9S12XEQ512CAL Freescale Semiconductor, MC9S12XEQ512CAL Datasheet - Page 833

• Manufacturer Part Number: MC9S12XEQ512CAL
• Description: MCU 16BIT 512K FLASH 112-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XEQ512CAL

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 91
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 112-LQFP
• No. Of I/o's: 91
• Eeprom Memory Size: 4KB
• Ram Memory Size: 32KB
• Cpu Speed: 50MHz
• No. Of Timers: 3
• No. Of Pwm Channels: 8
• Digital Ic Case Style: LQFP
• Rohs Compliant: Yes
• Processor Series: S12XE
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 32 KB
• Interface Type: CAN, SCI, SPI
• Maximum Clock Frequency: 50 MHz
• Number Of Programmable I/os: 91
• Number Of Timers: 25
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: KIT33812ECUEVME, EVB9S12XEP100, DEMO9S12XEP100
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 16 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Chapter 24
128 KByte Flash Module (S12XFTM128K2V1)
Freescale Semiconductor
Revision
Number
V01.10
V01.11
V01.12
30 Nov 2007
19 Dec 2007
25 Sep 2009
Revision
Date
24.1.2.2/24-835
24.3.2.1/24-845
24.4.2.4/24-872
24.4.2.6/24-873
24.3.2.1/24-845
24.4.1.2/24-864
24.1.3/24-836
24.4.2/24-869
24.4.2/24-869
24.4.2/24-869
24.4.2/24-869
24.3.1/24-838
24.1.3/24-836
24.3.1/24-838
24.3.1/24-838
24.3.2/24-843
24.4.2.11/24-
24.4.2.11/24-
24.4.2.11/24-
24.4.2.19/24-
24.1/24-834
24.6/24-892
Sections
Affected
MC9S12XE-Family Reference Manual , Rev. 1.23
877
877
877
886
Table 24-1. Revision History
- Correction
- Removed Load Data Field command 0x05
- Updated Command Error Handling tables based on parent-child relationship
with FTM256K2
- Corrected Error Handling table for Full Partition D-Flash, Partition D-Flash,
and EEPROM Emulation Query commands
- Corrected maximum allowed ERPART for Full Partition D-Flash and Partition
D-Flash commands
- Corrected P-Flash IFR Accessibility table
- Corrected Buffer RAM size in Feature List
- Corrected EEE Resource Memory Map
- Changed D-Flash size from 16Kbytes to 32Kbytes
- Corrected P-Flash Memory Map
- Change references for D-Flash from 16 Kbytes to 32 Kbytes
- Clarify single bit fault correction for P-Flash phrase
- Expand FDIV vs OSCCLK Frequency table
- Add statement concerning code runaway when executing Read Once
command from Flash block containing associated fields
- Add statement concerning code runaway when executing Program Once
command from Flash block containing associated fields
- Add statement concerning code runaway when executing Verify Backdoor
Access Key command from Flash block containing associated fields
- Relate Key 0 to associated Backdoor Comparison Key address
- Change “power down reset” to “reset”
- Add ACCERR condition for Disable EEPROM Emulation command
The following changes were made to clarify module behavior related to Flash
register access during reset sequence and while Flash commands are active:
- Add caution concerning register writes while command is active
- Writes to FCLKDIV are allowed during reset sequence while CCIF is clear
- Add caution concerning register writes while command is active
- Writes to FCCOBIX, FCCOBHI, FCCOBLO registers are ignored during
reset sequence
toTable 24-6
Description of Changes
833