MC68HC705C9ACFBE Freescale Semiconductor, MC68HC705C9ACFBE Datasheet - Page 109

• Manufacturer Part Number: MC68HC705C9ACFBE
• Description: IC MCU 8BIT 44-QFP
• Manufacturer: Freescale Semiconductor
• Series: HC05r

Specifications of MC68HC705C9ACFBE

• Core Processor: HC05
• Core Size: 8-Bit
• Speed: 2.1MHz
• Connectivity: SCI, SPI
• Peripherals: POR, WDT
• Number Of I /o: 24
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: OTP
• Ram Size: 352 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-QFP
• Processor Series: HC705C
• Core: HC05
• Data Bus Width: 8 bit
• Data Ram Size: 352 B
• Interface Type: SCI, SPI
• Maximum Clock Frequency: 2.1 MHz
• Number Of Programmable I/os: 31
• Number Of Timers: 1
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8 bit
• Package: 44PQFP
• Family Name: HC05
• Maximum Speed: 2.1 MHz
• Operating Supply Voltage: 3.3|5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Details

13.4 44-Lead Plastic Leaded Chip Carrier (PLCC) (Case 777-02)
Freescale Semiconductor
-L-
C
0.010 (0.25)
Z
44
G
G1
S
A
R
T
1
L-M
-N-
MC68HC05C9A Advance Information Data Sheet, Rev. 4.1
NOTES:
MINED
V
1. DATUMS -L-, -M-, AND -N- ARE DETERMINED
2. DIMENSION G1, TRUE POSITION TO BE
3. DIMENSION R AND U DO NOT INCLUDE MOLD
4. DIMENSIONING AND TOLERANCING PER ANSI
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
7. DIMINSION H DOES NOT INCLUDE DAMBAR
WHERE TOP OF LEAD SHOLDERS EXITS
PLASTIC BODY AT MOLD PARTING LINE.
MEASURED AT DATUM -T-, SEATING PLANE.
FLASH. ALLOWABLE MOLD FLASH IS 0.010
(0.25) PER SIDE.
Y14.5M, 1982.
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE DETER-
AT THE OUTERMOST EXTREMES OF THE
PLASTIC BODY EXCLUSIVE OF THE MOLD
FLASH, TIE BAR BURRS, GATE BURRS AND
INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM
OF THE PLASTIC BODY.
PROTRUSION OR INTRUSION. THE DAMBAR
PROTUSION(S) SHALL NOT CAUSE THE H
DIMINSION TO BE GREATER THAN 0.037
(0.940110). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMINISION TO SMALLER
THAN 0.025 (0.635).
S
Figure 13-3. 44-Lead PLCC (Case 777-02)
N S
E
Y
BRK
0.007(0.180)
0.007(0.180)
-M-
W
J
VIEW S
D
D
-T-
M
M
T
T
0.004 (0.10)
SEATING
PLANE
L-M
L-M
44-Lead Plastic Leaded Chip Carrier (PLCC) (Case 777-02)
S
S
DIM
G1
K1
W
N S
N S
G
A
B
C
E
F
H
K
R
U
V
X
Y
Z
J
0.042
MIN
0.685
0.685
0.165
0.090
0.013
0.026
0.020
0.025
0.650
0.650
0.042
0.042
0.610
0.040
2°
0.050 BSC
B
INCHES
X
Z
K
VIEW D-D
MAX
0.695
0.695
0.180
0.110
0.019
0.032
0.656
0.656
0.048
0.048
0.056
0.020
0.630
10°
U
VIEW S
0.007(0.180)
H
17.40
17.40
16.51
16.51
15.50
MIN
4.20
2.29
0.33
0.66
0.51
0.64
1.07
1.07
1.07
1.02
MILLIMETERS
2°
0.007(0.180)
1.27 BSC
0.007(0.180)
F
MAX
K1
17.65
17.65
16.66
16.66
16.00
4.57
2.79
0.48
0.81
1.21
1.21
1.42
0.50
10°
M
0.007(0.180)
G1
0.010 (0.25)
T
M
M
L-M
T
T
S
M
L-M
L-M
S
N S
T
T
S
S
L-M
L-M
N S
N S
S
S
N S
N S
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