HD64F3644H Renesas Electronics America, HD64F3644H Datasheet - Page 546

• Manufacturer Part Number: HD64F3644H
• Description: IC H8 MCU FLASH 32K 64-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Lr

Specifications of HD64F3644H

• Core Processor: H8/300L
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI
• Peripherals: PWM, WDT
• Number Of I /o: 53
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 64-QFP
• Package: 64PQFP
• Family Name: H8
• Maximum Speed: 8 MHz
• Operating Supply Voltage: 3.3|5 V
• Data Bus Width: 8 Bit
• Number Of Programmable I/os: 45
• Interface Type: SCI
• On-chip Adc: 8-chx8-bit
• Number Of Timers: 4
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Appendix F Package Dimensions
The package dimension that is shown in the Package Data Book has priority.
Rev. 6.00 Sep 12, 2006 page 524 of 526
REJ09B0326-0600
P-QFP64-14x14-0.80
JEITA Package Code
49
64
e
48
1
PRQP0064GB-A
RENESAS Code
Z
D
Appendix F Package Dimensions
*1
H
D
D
y
Figure F.1 FP-64A Package Dimensions
*3
b
p
FP-64A/FP-64AV
Previous Code
33
16
x
32
17
M
F
MASS[Typ.]
1.2g
Terminal cross section
Detail F
b
b
1
p
L
1
L
NOTE)
1. DIMENSIONS"*1"AND"*2"
2. DIMENSION"*3"DOES NOT
DO NOT INCLUDE MOLD FLASH
INCLUDE TRIM OFFSET.
Reference
Symbol
e
D
E
A
H
H
A
A
b
b
c
c
x
y
Z
Z
L
L
1
p
1
1
2
1
D
E
D
E
Dimension in Millimeters
16.9
16.9 17.2 17.5
0.00
0.29
0.12
Min
0.5
0˚
Nom
2.70
17.2
0.10
0.37
0.35
0.17
0.15
0.8
1.0
1.0
0.8
1.6
14
14
Max
17.5
3.05
0.25
0.45
0.22
0.15
0.10
1.1
8˚