HD64F2218TF24 Renesas Electronics America, HD64F2218TF24 Datasheet - Page 55
HD64F2218TF24
Manufacturer Part Number
HD64F2218TF24
Description
IC H8S MCU FLASH 128K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Specifications of HD64F2218TF24
Core Processor
H8S/2000
Core Size
16-Bit
Speed
24MHz
Connectivity
SCI, SmartCard, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
69
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
12K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
For Use With
3DK2218-SS - KIT DEV H8S/2218 WINDOWS SIDESHW
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
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Table 19.2
Table 19.3
Table 19.4
Section 20 Power-Down Modes
Table 20.1
Table 20.2
Table 20.3
Table 20.4
Section 22 Electrical Characteristics
Table 22.1
Table 22.2
Table 22.3
Table 22.4
Table 22.5
Table 22.6
Table 22.7
Table 22.8
Table 22.9
Table 22.10 Flash Memory Characteristics................................................................................ 683
Crystal Resonator Characteristics........................................................................... 600
External Clock Input Conditions ............................................................................ 601
External Clock Input Conditions when Duty Adjustment Circuit Is not Used....... 602
LSI Internal States in Each Mode........................................................................... 608
Transition Conditions of Power-Down Modes....................................................... 610
Oscillation Stabilization Time Settings .................................................................. 620
φ Pin State in Each Processing State ...................................................................... 627
Absolute Maximum Ratings................................................................................... 657
DC Characteristics.................................................................................................. 659
Permissible Output Currents................................................................................... 662
Clock Timing.......................................................................................................... 664
Control Signal Timing............................................................................................ 666
Bus Timing............................................................................................................. 668
Timing of On-Chip Supporting Modules ............................................................... 675
USB Characteristics (USD+ and USD- pins) when On-Chip USB Transceiver Is
Used........................................................................................................................ 680
A/D Conversion Characteristics ............................................................................. 682
Rev.7.00 Dec. 24, 2008 Page liii of liv
REJ09B0074-0700
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